Substrate processing apparatus, substrate processing method and storage medium
Disclosed is a substrate processing apparatus capable of drying a substrate to be processed while suppressing a pattern collapse or occurrence of contamination. In a processing vessel, a substrate is immersed in a liquid in the longitudinal direction, and the liquid is pushed out by a substitution fluid of a supercritical state to be discharged from the processing vessel. Thereafter, the substitution fluid subjected to the substitution with the liquid is discharged from the processing vessel to depressurize the processing vessel, and the substitution fluid is changed from the supercritical state to a gaseous state to dry the substrate.
1. A substrate processing apparatus, comprising:
an external chamber including a processing space;
an internal chamber where a liquid in which a substrate to be processed is immersed is substituted with a substitution fluid of a supercritical state to dry the substrate, the internal chamber being configured to be inserted into the processing space of the external chamber via an opening in the front surface of the external chamber in a state where the substrate to be processed is immersed in the liquid of the internal chamber;
a traveling track configured to allow the transfer of the internal chamber into the external chamber, by carrying the internal chamber horizontally through the opening in the front surface of the external chamber;
a substrate holding unit provided on a bottom of the internal chamber and configured to hold the substrate in a vertical direction;
a substitution fluid supplying unit formed on a side surface of the external chamber and configured to supply the substitution fluid in a liquid state to the external chamber;
an energy supplying unit to change the substitution fluid from the liquid state to the supercritical state of the substitution fluid in the external chamber by performing at least heating of heating and pressurizing of the substitution fluid;
a liquid discharging unit formed on the bottom of the internal chamber and configured to substitute the liquid with the supercritical-state substitution fluid by discharging the liquid from the internal chamber; and
an exhaust unit formed on a side of the external chamber and configured to depressurize the external chamber by discharging the supercritical-state substitution fluid subjected to substitution with the liquid from the external chamber and dry the substrate by changing the substitution fluid from the supercritical state to a gaseous state,
wherein a top portion of the internal chamber is opened with an opening, and
the substitution fluid supplying unit configured to supply the substitution fluid to a space between an inner surface of the external chamber and an outer surface of the internal chamber such that the substitution fluid is expanded to enter the internal chamber through the opening the top portion.
2. The substrate processing apparatus of claim 1 , wherein the opening of the internal chamber includes a saw-like notch unit so that the supercritical fluid in the processing space will be uniformly introduced into the internal chamber.