Gated bipolar junction transistors
Some embodiments include gated bipolar junction transistors. The transistors may include a base region between a collector region and an emitter region; with a B-C junction being at an interface of the base region and the collector region, and with a B-E junction being at an interface of the base region and the emitter region. The transistors may include material having a bandgap of at least 1.2 eV within one or more of the base, emitter and collector regions. The gated transistors may include a gate along the base region and spaced from the base region by dielectric material, with the gate not overlapping either the B-C junction or the B-E junction. Some embodiments include memory arrays containing gated bipolar junction transistors. Some embodiments include methods of forming gated bipolar junction transistors.
1. A semiconductor construction, comprising:
a gated bipolar junction transistor which includes:
a base region between a collector region and an emitter region;
a B-C junction at an interface of the base region and the collector region;
a B-E junction at an interface of the base region and the emitter region;
at least part of at least one of the base region, the collector region and the emitter region comprising at least one wide bandgap material, said at least one wide bandgap material having a bandgap of at least 1.2 eV; and
a gate along the base region and spaced from the base region by dielectric material; the gate not overlapping either the B-C junction or the B-E junction.
2. The semiconductor construction of claim 1 , wherein the base region comprises a first dopant type, and wherein each of the emitter region and the collector region comprises a second dopant type which is opposite to the first dopant type.
3. The semiconductor construction of claim 1 , wherein the base region, the emitter region and the collector region all comprise a common dopant type as one another, and wherein the base region is less heavily doped than either of the emitter region and the collector region.
4. The semiconductor construction of claim 1 , further comprising:
a mode of operation in which there is a B-E depletion region that extends across the B-E junction, and in which there is a B-C depletion region that extends across the B-C junction; and
the gate not overlapping either of the B-E depletion region and the B-C depletion region.
5. The semiconductor of claim 4 , wherein the B-E depletion region and the B-C depletion region are entirely contained within the at least one of wide bandgap material having the bandgap of at least 1.2 eV.
6. The semiconductor construction of claim 5 , wherein the wide bandgap material of the B-E depletion region and the wide bandgap material of the B-C depletion region are the same.
7. The semiconductor construction of claim 5 , wherein the wide bandgap material of the B-E depletion region is different from the wide bandgap material of the B-C depletion region.
8. The semiconductor construction of claim 5 , wherein the wide bandgap material having the bandgap of at least 1.2 eV extends entirely across the base region.
9. The semiconductor construction of claim 1 , wherein the wide bandgap material having the bandgap of at least 1.2 eV comprises silicon and carbon.
10. The semiconductor construction of claim 1 , wherein the base region, the emitter region and the collector region are entirely comprised by the at least one wide bandgap material having the bandgap of at least 1.2 eV.
11. The semiconductor construction of claim 10 , wherein the wide bandgap material of the emitter region and the wide bandgap material of the base region are the same, wherein the wide bandgap material having the bandgap of at least 1.2 eV.
12. The semiconductor construction of claim 10 , wherein the wide bandgap material of the emitter region is different from the wide bandgap material of the base region, wherein the wide bandgap material of each of the emitter region and the base region having the bandgap of at least 1.2 eV.
13. The semiconductor construction of claim 10 , wherein the wide bandgap material of the collector region and the wide bandgap material of are the same, wherein the wide bandgap material having the bandgap of at least 1.2 eV.
14. The semiconductor construction of claim 10 , wherein the wide bandgap material of the collector region is different from the wide bandgap material of the base region, wherein the wide bandgap material of each of the collector region and the base region having the bandgap of at least 1.2 eV.
15. The semiconductor construction of claim 10 , wherein the wide bandgap material of the base region, the wide bandgap material of emitter region and the wide bandgap material of collector region are the same, wherein the wide bandgap material having the bandgap of at least 1.2 eV.
16. The semiconductor construction of claim 1 , further comprising:
one of the emitter region and the collector region being coupled with a bitline and being a first region, and the other one of the emitter region and the collector region being coupled with a node and being a second region; and
wherein the wide bandgap material having the bandgap of at least 1.2 eV extends entirely across the first region.
17. The semiconductor construction of claim 16 , wherein the wide bandgap material having the bandgap of at least 1.2 eV also extends entirely across the second region.
18. A semiconductor construction, comprising:
a gated bipolar junction transistor which includes:
a base region between a collector region and an emitter region;
a B-C junction at an interface of the base region and the collector region;
a B-E junction at an interface of the base region and the emitter region;
at least part of at least one of the base region, the collector region and the emitter region comprising a wide bandgap material, said wide bandgap material having a bandgap of at least 2.3 eV;
a gate along the base region and spaced from the base region by a dielectric material; and
the gate being only coupled with the base region in operation such that any gate induced leakage is less than the combination of base/emitter junction leakage and base/collector junction leakage.
19. The semiconductor construction of claim 18 , wherein the B-C junction is within the wide bandgap material having the bandgap of at least about 2.3 eV.
20. The semiconductor construction of claim 18 , wherein the B-E junction is within the wide bandgap material having the bandgap of at least about 2.3 eV.
21. The semiconductor construction of claim 18 , wherein the wide bandgap material of the B-C junction and the wide bandgap material of the B-E junction are the same, wherein the wide bandgap material having the bandgap of at least about 2.3 eV.
22. The semiconductor construction of claim 18 , wherein the wide bandgap material having the bandgap of at least about 2.3 eV comprises silicon and carbon.