IP Library Granted Patent US 9,003,644
Granted Patent B2
US 9,003,644 · App. 13/651,562 · Granted Apr 14, 2015

PNP apparatus and PNP tool head with direct bonding pressure pick-up tip

Inventors: Hk Looi (Singapore, SG); Cheng-hai Cheh (Singapore, SG); HaiKin Toh (Singapore, SG)
Assignee: STMicroelectronics Pte Ltd
B25J15/0616Y10S901/40H05K13/0404H05K13/0408
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,003,644
App. No.
13/651,562
Granted
Apr 14, 2015
Kind
B2
Abstract

A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

Claims (34)

1. A pick-and-place (PNP) apparatus comprising:

a robotic arm; and

a PNP tool head carried by said robotic arm comprising

a body configured to directly apply bonding pressure to a first area of an electronic device, and

a pick-up tip movable between an extended position and a retracted position relative to said body as said pick-up tip rests against a second area of the electronic device, said pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device, the electronic device comprising an image sensor housing defining the first area, and a lens barrel carried by the image sensor housing defining the second area, the first area extending from the second area to a periphery of the electronic device.

2. The PNP apparatus of claim 1 wherein said body has a tip receiving passageway therein; and wherein said pick-up tip is slidably received within the tip receiving passageway.

3. The PNP apparatus of claim 1 further comprising:

a bond head coupled to said robotic arm; and

at least one bias member coupled between said bond head and said body.

4. The PNP apparatus of claim 3 wherein said bond head has a recess therein configured to receive said pick-up tip when in the retracted position.

5. The PNP apparatus of claim 1 wherein said pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

6. The PNP apparatus of claim 1 further comprising a controller coupled to said robotic arm.

7. The PNP apparatus of claim 1 wherein the electronic device has a rectangular shape with four upper corner portions defining the first area.

8. The PNP apparatus of claim 1 wherein the electronic device has a rectangular shape with an upper medial portion defining the second area; and wherein the at least one vacuum passageway comprises a single vacuum passageway aligned with the upper medial portion of the electronic device.

9. A pick-and-place (PNP) apparatus comprising:

a robotic arm;

a controller coupled to said robotic arm; and

a PNP tool head carried by said robotic arm comprising

a body configured to directly apply bonding pressure to a first area of an electronic device, and having a tip receiving passageway therein, and

a pick-up tip slidably received within the tip receiving passageway and movable between an extended position and a retracted position relative to said body as said pick-up tip rests against a second area of the electronic device, said pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device, the electronic device comprising an image sensor housing defining the first area, and a lens barrel carried by the image sensor housing defining the second area, the first area extending from the second area to a periphery of the electronic device.

10. The PNP apparatus of claim 9 further comprising:

a bond head coupled to said robotic arm; and

at least one bias member coupled between said bond head and said body.

11. The PNP apparatus of claim 10 wherein said bond head has a recess therein configured to receive said pick-up tip when in the retracted position.

12. The PNP apparatus of claim 9 wherein said pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

13. A pick-and-place (PNP) tool head comprising:

a body configured to directly apply bonding pressure to a first area of an electronic device; and

a pick-up tip movable between an extended position and a retracted position relative to said body as said pick-up tip rests against a second area of the electronic device, said pick-up tip defining at least one vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device, the electronic device comprising an image sensor housing defining the first area, and a lens barrel carried by the image sensor housing defining the second area, the first area extending from the second area to a periphery of the electronic device.

14. The PNP tool head of claim 13 wherein said body has a tip receiving passageway therein; and wherein said pick-up tip is slidably received within the tip receiving passageway.

15. The PNP tool head of claim 13 further comprising:

a bond head coupled to said robotic arm; and

at least one bias member coupled between said bond head and said body.

16. The PNP tool head of claim 15 wherein said bond head has a recess therein configured to receive said pick-up tip when in the retracted position.

17. The PNP tool head of claim 13 wherein said pick-up tip has a tubular shape with a distal open end defining the at least one vacuum passageway, and a vacuum source port coupled in fluid communication with the distal open end.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060127/0427 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 029128 FRAME: 0077. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 12, 2015
From: LOOI, HK
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035186/0938 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 029128 FRAME: 0077. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 12, 2015
From: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035188/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2012
From: LOOI, HK; CHEH, CHENGHAI; TOH, HAIKIN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 029128/0077 →
Continuity (1)
Related Publication 20140105717A1 · Apr 17, 2014