Process for producing substrate and substrate processing method
The invention provides a process for producing a protective-layer-provided substrate in which a protective layer is formed on a substrate on the surface of which a plurality of structures have been arranged at intervals. The protective layer has a resin layer and a film for chucking. The process includes the steps of forming the resin layer between the respective structures, on the surfaces of the respective structures and on the surface of the substrate having the plurality of the structures; and forming the film for chucking on the resin layer to form the protective layer.
1. A process for producing a treated substrate by using a protective layer, the process comprising, in stated order (1)-(4):
(1) providing a substrate having on a surface thereof a plurality of respective structures protruding from the surface and arranged at intervals;
(2) forming a resin layer (i) to fill a gap between the respective structures, (ii) on surfaces of the respective structures, and (iii) on the surface of the substrate on which the plurality of the structures are arranged;
(3) forming a film for chucking on the resin layer to form the protective layer, where the protective layer comprises the resin layer and the film; and
(4) subjecting the substrate on which the film has been formed to a vacuum process.
2. The production process according to claim 1 , wherein the respective structures form at least one pattern among an ink flow path through which an ink flows, an ink chamber in which an ejection-pressure-generating element for generating energy for ejecting the ink is formed, and an ink ejection orifice from which an ink is ejected.
3. The production process according to claim 1 , wherein in the step (2), a liquid resin is applied between the respective structures, on the surfaces of the
respective structures and on the surface of the substrate having the plurality of the structures by a spin coating method and then baked to form the resin layer.
4. The production process according to claim 3 , wherein the viscosity of the liquid resin is 0.2 Pa·s or more and 0.8 Pa·s or less at 25° C.
5. The production process according to claim 1 , wherein the resin layer comprises a thermoplastic resin.
6. The production process according to claim 1 , wherein in the step (3), the film for chucking is formed on the resin layer while heating the resin layer to
a temperature not lower than the softening point of the resin layer.
7. The production process according to claim 1 , wherein the softening point of the resin layer is 30° C. or more and 100° C. or less.
8. The production process according to claim 1 , wherein the resin layer comprises a cyclized rubber as a main material.
9. The production process according to claim 1 , wherein in the step (3), the film for chucking is laminated under reduced pressure.
10. The production process according to claim 1 , wherein the film for chucking is a conductive film.
11. The production process according to claim 10 , wherein the conductive film is a conductive polymer film.
12. The production process according to claim 10 , wherein the conductive film is an ITO film.
13. The production process according to claim 1 , wherein the vacuum process comprises dry etching.
14. The production process according to claim 1 , wherein the vacuum process comprises vacuum film formation.
15. The production process according to claim 1 , wherein the film for chucking is formed so as to cover a side of the substrate.