Semiconductor device and fabrication method thereof
An MOSFET includes a silicon carbide substrate, an active layer, a gate oxide film, and a gate electrode. The active layer includes a body region where an inversion layer is formed at a region in contact with the gate oxide film by application of voltage to the gate electrode. The body region includes a low concentration region arranged at a region where an inversion layer is formed, and containing impurities of low concentration, and a high concentration region adjacent to the low concentration region in the carrier mobile direction in the inversion layer, arranged in a region where the inversion layer is formed, and containing impurities higher in concentration than in the low concentration region.
1. A method of fabricating a semiconductor device comprising the steps of:
preparing a substrate made of silicon carbide,
forming an epitaxial growth layer made of silicon carbide on said substrate,
forming a body region at said epitaxial growth layer,
forming a gate insulation film made of an insulator to come into contact above said epitaxial growth layer, and
forming a gate electrode to which voltage is applied to form an inversion layer in a region of said body region in contact with said gate insulation film,
said step of forming a body region including the steps of
forming a mask layer having an opening on said epitaxial growth layer,
forming a first concentration region having a first impurity concentration at the region where said inversion layer is formed by applying ion implantation with said mask layer as a mask,
enlarging said opening by etching said mask layer, and
forming a second concentration region having a second impurity concentration differing from said first impurity concentration, adjacent to said first concentration region in a carrier mobile direction in said inversion layer, and at a region where said inversion layer is formed, by executing ion implantation using said mask layer having said opening enlarged as a mask.