Device and method for inspecting semiconductor wafers
Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.
1. Device for inspecting semiconductor wafers comprising:
a wafer transport arm which is provided with at least one wafer support element comprising a gripper for gripping wafers, the gripper comprising two remote limbs which are configured to hold opposing edges of the wafer, the gripper being rotatably mounted on a shaft so as to be able to rotate the wafer between a substantially horizontal position and a substantially vertical position, and
at least two inspection systems which are arranged at one side and the other of the wafer in its substantially vertical position, symmetrically relative to the plane which extends through the wafer,
wherein each inspection system comprises at least one light source and at least one camera, each camera being positioned in order to capture the light reflected by the surface of the wafer opposite it and each light source being positioned in order to transmit an incident light beam towards the surface,
wherein each light source comprises a video screen arranged to illuminate a respective face of the wafer, and
wherein, during use, the inspection systems are actuated when the wafer is immobile in a substantially vertical position.
2. Device according to claim 1 , wherein the transport arm comprises at least two articulation axes and is supported by a turret which supports at least one wafer transport arm, the turret being translatably mounted on a sliding member.
3. Device according to claim 1 , wherein each limb of the gripper has a groove which is provided on a surface arranged opposite the other limb.
4. Device according to claim 3 , wherein the groove is generally V-shaped.
5. Device according to claim 1 , wherein at least one of the limbs is mounted for pivoting about an axis which is substantially perpendicular relative to the plane of the wafer held between the limbs.
6. Device according to claim 1 , wherein the transport elements have a lateral spatial requirement smaller than the opening between the limbs of the gripper.
7. Device according to claim 1 , wherein each light source comprises a monitor whose smallest dimension is more than 1.5 times greater than the maximum opening between the limbs of the gripper.
8. Device according to claim 7 , wherein the monitor comprises an LCD or plasma screen.
9. Device according to claim 1 , wherein the camera is arranged above the light source.
10. Device according to claim 1 , further comprising a control unit which is configured to control the display of parallel lines by the light sources.
11. Device according to claim 10 , wherein the control unit comprises at least one output which is connected to a camera and at least one output which is connected to the corresponding light source in order to synchronize the camera and the light source.
12. Device according to claim 10 , wherein the control unit is configured to control an illuminated oval zone of the light source and a dark outer edge.
13. Device according to claim 10 , wherein the control unit is configured to control the display of different colors simultaneously by the light sources.
14. Device according to claim 10 , wherein the control unit is configured to control an alternating illumination by the light sources.
15. Method for inspecting semiconductor wafers, comprising:
conveying a semiconductor wafer to be inspected by at least one support element belonging to a transport arm, the support element comprising remote limbs, which are part of a gripper, wherein the gripper grips opposite edges of the wafer;
rotating the gripper about a shaft which causes the wafer to move from a substantially horizontal position to a substantially vertical position; and
while the gripper holds the wafer in a fixed substantially vertical position, actuating at least two inspection systems, which are arranged at one side and the other of the wafer in its substantially vertical position, symmetrically relative to the plane which extends through the wafer,
wherein each inspection system comprises at least one light source and at least one camera, each camera being positioned in order to capture the light reflected by the surface of the wafer opposite it and each light source being positioned in order to transmit an incident light beam towards the surface;
wherein each light source comprises a video screen arranged to illuminate a respective face of the wafer.
16. The method according to claim 15 , wherein each light source of each of the inspection systems illuminates the wafer with a wavelength light that is different from the wavelength of light used by the other inspection system.
17. The method according to claim 15 , wherein each light source is alternatively activated such that only one light source is illuminating the wafer during inspection.