Electronic chip component and board having the same mounted thereon
An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.
1. An electronic chip component comprising:
a ceramic body;
external electrodes formed on end portions of the ceramic body in a length direction thereof; and
an interposer supporting the ceramic body and electrically connected to the external electrodes,
wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface of the interposer between the surface and the opposing surface of the interposer,
the first electrode pad is divided into a first electrode pattern and a second electrode pattern disposed at ends of the interposer based on a space formed therebetween,
a non-electrode margin portion is formed between ends of the first electrode pad in a length direction of the interposer and the ends of the interposer in the length direction thereof, and
the connection electrode pad is formed on the lateral surface of the interposer forming the space.
2. The electronic chip component of claim 1 , wherein the space is provided as a through hole, and
the through hole is disposed in a central portion of the interposer.
3. The electronic chip component of claim 1 , wherein the space is provided as indent portions formed inwardly from ends of the interposer in a width direction thereof.
4. The electronic chip component of claim 1 , wherein head surfaces of the external electrodes are disposed on the non-electrode margin portion when the external electrodes are disposed on the interposer.
5. The electronic chip component of claim 1 , wherein the non-electrode margin portion is further formed on ends of the interposer in a width direction thereof, and
lateral surfaces of the external electrodes are disposed on the non-electrode margin portion when the external electrodes are disposed on the interposer.
6. The electronic chip component of claim 1 , wherein the external electrodes are extended inwardly from the end portions of the ceramic body in the length direction thereof, and
internal edges of the external electrodes are disposed adjacently to the space when the external electrodes are disposed on the interposer.
7. The electronic chip component of claim 6 , wherein the internal edges of the external electrodes are disposed above the space.
8. The electronic chip component of claim 6 , wherein the internal edges of the external electrodes are disposed on the first electrode pattern and the second electrode pattern.
9. The electronic chip component of claim 1 , wherein the ceramic body includes internal electrodes and dielectric layers alternately stacked therein, and
the internal electrodes are disposed in parallel to the first electrode pad.
10. A board having an electronic chip component mounted thereon, the board comprising:
the electronic chip component of claim 1 ; and
a printed circuit board (PCB) including land patterns electrically connected to the second electrode pad to be connected to the electronic chip component,
wherein the land patterns are soldered to be electrically connected to the external electrodes through the connection electrode pad disposed in the space.
11. The board of claim 10 , wherein the space is provided as a through hole having a rectangular shape, and
the electronic chip component is soldered along the connection electrode pad in the through hole.
12. The board of claim 10 , wherein the space is provided as indent portions formed inwardly from ends of the interposer in a width direction thereof, and
the electronic chip component is soldered along the connection electrode pad in the indent portions.
13. The board of claim 10 , wherein head surfaces of the external electrodes are disposed on the non-electrode margin portion when the external electrodes are disposed on the interposer.
14. The board of claim 10 , wherein the non-electrode margin portion is further formed on ends of the interposer in a width direction thereof, and
lateral surfaces of the external electrodes are disposed on the non-electrode margin portion when the external electrodes are disposed on the interposer.
15. The board of claim 10 , wherein the external electrodes are extended inwardly from the end portions of the ceramic body in the length direction thereof, and
internal edges of the external electrodes are disposed adjacently to the space when the external electrodes are disposed on the interposer.
16. The board of claim 15 , wherein the internal edges of the external electrodes are disposed above the space.
17. The board of claim 15 , wherein the internal edges of the external electrode are disposed on the first electrode pattern and the second electrode pattern.
18. The board of claim 10 , wherein the ceramic body includes internal electrodes and dielectric layers alternately stacked therein, and
the internal electrodes are disposed in parallel to the first electrode pad.