IP Library › Granted Patent US 9,054,138
Granted Patent B2
US 9,054,138 · App. 14/486,187 · Granted Jun 9, 2015

Semiconductor device and method for manufacturing the same

Inventors: Shunpei Yamazaki (Setagaya, JP); Masayuki Sakakura (Tochigi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/66969H01L21/02554H01L21/02565H01L27/1225H01L29/7869H01L33/42H01L2924/0002H01L27/124
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Quick Facts
Patent No.
US 9,054,138
App. No.
14/486,187
Granted
Jun 9, 2015
Kind
B2
Abstract

It is an object to manufacture and provide a highly reliable display device including a thin film transistor with a high aperture ratio which has stable electric characteristics. In a manufacturing method of a semiconductor device having a thin film transistor in which a semiconductor layer including a channel formation region is formed using an oxide semiconductor film, a heat treatment for reducing moisture and the like which are impurities and for improving the purity of the oxide semiconductor film (a heat treatment for dehydration or dehydrogenation) is performed. Further, an aperture ratio is improved by forming a gate electrode layer, a source electrode layer, and a drain electrode layer using conductive films having light transmitting properties.

Claims (34)

1. A method of manufacturing a display panel comprising:

forming a first conductive film over a substrate;

selectively etching the first conductive film to form a gate electrode of a transistor in a pixel portion and a first conductive layer in a terminal portion;

forming a first insulating film over the gate electrode and the first conductive layer;

forming a first transparent conductive film over the first insulating film;

selectively etching the first transparent conductive film to form a first transparent conductive layer in the terminal portion, the first transparent conductive layer overlapping with the first conductive layer;

forming a second insulating film over the first transparent conductive layer;

forming a second transparent conductive film over the second insulating film;

selectively etching the second transparent conductive film to form a pixel electrode in the pixel portion and a second transparent conductive layer in the terminal portion,

wherein the pixel electrode is electrically connected to the transistor,

wherein the second transparent conductive layer is in contact with the first transparent conductive layer through an opening of the second insulating film, and

wherein the second transparent conductive layer is electrically connected to the first conductive layer through an opening of the first insulating film.

2. The method according to claim 1 , wherein the first conductive film has a light transmitting property.

3. The method according to claim 1 , wherein the transistor is a bottom gate thin film transistor.

4. The method according to claim 1 , further comprising a step of forming a semiconductor layer over the first insulating film.

5. The method according to claim 1 , further comprising a step of forming an oxide semiconductor layer over the first insulating film.

6. The method according to claim 1 , wherein the second transparent conductive layer is in direct contact with the first conductive layer.

7. A method of manufacturing a display panel comprising:

forming a first conductive film over a substrate;

selectively etching the first conductive film to form a gate electrode of a transistor in a pixel portion and a first conductive layer in a terminal portion;

forming a first insulating film over the gate electrode and the first conductive layer;

forming a first transparent conductive film over the first insulating film;

selectively etching the first transparent conductive film to form a first transparent conductive layer in the terminal portion and a capacitor electrode in the pixel portion, the first transparent conductive layer overlapping with the first conductive layer;

forming a second insulating film over the first transparent conductive layer;

forming a second transparent conductive film over the second insulating film;

selectively etching the second transparent conductive film to form a pixel electrode in the pixel portion and a second transparent conductive layer in the terminal portion,

wherein the pixel electrode is electrically connected to the transistor,

wherein the second transparent conductive layer is in contact with the first transparent conductive layer through an opening of the second insulating film, and

wherein the second transparent conductive layer is electrically connected to the first conductive layer through an opening of the first insulating film.

8. The method according to claim 7 , wherein the first conductive film has a light transmitting property.

9. The method according to claim 7 , wherein the transistor is a bottom gate thin film transistor.

10. The method according to claim 7 , further comprising a step of forming a semiconductor layer over the first insulating film.

11. The method according to claim 7 , further comprising a step of forming an oxide semiconductor layer over the first insulating film.

12. The method according to claim 7 , wherein the second transparent conductive layer is in direct contact with the first conductive layer.

Priority Claims (1)
JP 2009-164265 · Jul 10, 2009 · national
Continuity (4)
Continuation 13856590 · Apr 4, 2013
Continuation 13658201 · Oct 23, 2012
Continuation 12832334 · Jul 8, 2010
Related Publication 20150004745A1 · Jan 1, 2015