Method for forming Cu wiring
A Cu wiring forming method forms Cu wiring in a recess of a predetermined pattern including a trench formed in an insulating film on a substrate surface. The method includes: forming a barrier film at least on a surface of the recess; forming a Cu film by PVD to fill the recess with the Cu film; forming an additional layer on the Cu film; polishing an entire surface by CMP to form the Cu wiring in the recess; forming a metal cap including a manganese oxide film on an entire surface including the insulating film and the Cu wiring of the substrate after performing the CMP polishing; and forming a dielectric cap on the metal cap.
1. A method for forming a Cu wiring in a recess formed in an insulating film on a substrate, the method comprising:
forming a barrier film on a surface of the recess and a surface of the insulating film outside the recess;
forming a Cu film by PVD on the barrier film to fill the recess with the Cu film;
forming an additional layer on the Cu film;
removing by CMP the barrier film, the Cu film and the additional film formed outside the recess while leaving the barrier film and the Cu film formed in the recess to thereby form the Cu wiring in the recess;
forming a metal cap formed of a manganese oxide film on an entire surface including the insulating film and the Cu wiring of the substrate; and
forming a dielectric cap on the metal cap.
2. The Cu wiring forming method of claim 1 , wherein said forming the metal cap includes forming the manganese oxide film by PVD, CVD or ALD.
3. The Cu wiring forming method of claim 1 , further comprising forming an Ru film between said forming the barrier layer and said forming the Cu film.
4. The Cu wiring forming method of claim 3 , wherein the Ru film is formed by CVD.
5. The Cu wiring forming method of claim 1 , wherein the Cu film is formed by an apparatus configured to generate a plasma from a plasma generation gas in a processing chamber where a substrate is accommodated, scatter elements emitted from a target formed of Cu, ionize the elements in the plasma and attract ions onto the substrate by applying a bias power to the substrate.
6. The Cu wiring forming method of claim 1 , wherein the additional layer is formed by forming a Cu film by PVD.
7. The Cu wiring forming method of claim 1 , wherein the barrier film is selected from a group consisting of a Ti film, a TiN film, a Ta film, a TaN film, a Ta/TaN bilayered film, a TaCN film, a W film, a WN film, a WCN film, a Zr film, a ZrN film, a V film, a VN film, a Mb film, and a NbN film.