Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.
1. A substrate for a power module with a heat sink comprising;
a ceramic substrate,
a first metal plate made of aluminum with one surface being bonded to a surface of said ceramic substrate,
a second metal plate made of aluminum with one surface being bonded to a rear surface of said ceramic substrate, and
a heat sink made of aluminum or aluminum alloy and bonded to the other surface of said second metal plate, which is opposite to said one surface bonded to said ceramic substrate,
and Cu is solid-solubilized into said second metal plate and said heat sink, and a Cu concentration at a position of 50 μm from a bonding surface between said second metal plate and said heat sink is set to a range of from 0.05% by mass to 5% by mass inclusive.
2. A substrate for a power module with a heat sink according to claim 1 , wherein one or more kinds of additive elements selected from Si, Zn, Ge, Ag, Mg, Ca, Ga, and Li are solid-solubilized in addition to Cu into said second metal plate and said heat sink.
3. A substrate for a power module with a heat sink according to claim 1 , wherein one or more kinds of additive elements selected from Zn, Ge, Ag, Mg, Ca, Ga, and Li are solid-solubilized in addition to at least one of Cu and Si into the vicinity of a bonding interface between said first metal plate and said ceramic substrate or the vicinity of a bonding interface between said second metal plate and said ceramic substrate.
4. A substrate for a power module with a heat sink according to claim 1 , wherein a thickness of said second metal plate is set to be thicker than that of said first metal plate.
5. A substrate for a power module with a heat sink according to claim 1 , wherein said second metal plate is formed by laminating a plurality of metal plates.
6. A power module comprising;
the substrate for a power module with a heat sink according to claim 1 , and
electronic parts mounted on said substrate for a power module with a heat sink.