Antenna modules for dual interface smart cards, booster antenna configurations, and methods
Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26 ) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
1. A module tape (MT) for an RFID antenna module (AM) comprising:
a substrate (MT); and
a support structure (SS, DS, WC) disposed on a surface of the substrate and comprising a tubular body portion (B) having two opposite open ends, one of which is disposed against the surface of the substrate, the other of which is a free end;
characterized by:
a planar element (LD, CP, PT) selected from the group consisting of a flange (F), a lid (LD, CP) and a tool (PT) disposed upon the free end of the support structure for constraining winding of the module antenna (MA) on the support structure;
wherein:
the planar element is in the form of a disc or ring having an outer diameter which is greater than an outer diameter of the tubular body portion (B).
2. The module tape of claim 1 , wherein:
at least one of the planar element and the tubular body portion comprise ferrite.
3. A method of making an antenna module (AM) interim product comprising:
providing a module tape (MT); and
providing support structure (SS, DS, WC) having a tubular body portion (B) on a surface of the module tape, the tubular body portion having an end on the surface of the module tape and a free end;
characterized by:
disposing a planar element (LD, CP, PT) against the free end of the body portion;
wherein the planar element is in the form of a ring, and further comprising:
with the planar element (LD, CP, PT) in place on the tubular body portion (B), filling an interior area of the body portion (B) with encapsulant (GT).
4. The method of claim 3 , wherein:
the support structure (SS, DS, WC) is formed on the module tape (MT) by an additive process.