IP Library › Granted Patent US 9,117,503
Granted Patent B2
US 9,117,503 · App. 13/597,520 · Granted Aug 25, 2015

Memory array plane select and methods

Inventors: Jong-Won Lee (San Francisco, CA); Gianpaolo Spadini (Los Gatos, CA)
Assignee: Micron Technology, Inc.
G11C8/12G11C5/025G11C11/1653G11C13/0004G11C2213/71
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Quick Facts
Patent No.
US 9,117,503
App. No.
13/597,520
Granted
Aug 25, 2015
Kind
B2
Abstract

Memory arrays and methods of forming the same are provided. An example memory array can include at least one plane having a plurality of memory cells arranged in a matrix and a plurality of plane selection devices. Groups of the plurality of memory cells are communicatively coupled to a respective one of a plurality of plane selection devices. A decode logic having elements is formed in a substrate material and communicatively coupled to the plurality of plane selection devices. The plurality of memory cells and the plurality of plane selection devices are not formed in the substrate material.

Claims (21)

1. A memory array, comprising:

a plurality of planes each having a plurality of memory cells arranged in a matrix and a plurality of plane selection devices, groups of the plurality of memory cells being communicatively coupled to a respective one of a plurality of plane selection devices, wherein a first plane is associated with a first number of access lines and a second plane is associated with a second number of access lines; and

a decode logic having elements formed in a substrate material and communicatively coupled to the plurality of plane selection devices,

wherein the first number of access lines and the second number of access lines are respectively coupled in parallel to a number of common access lines that are communicatively coupled to the decode logic, and

wherein the plurality of memory cells and the plurality of plane selection devices are not formed in the substrate material.

2. The memory array of claim 1 , wherein each of the plurality of memory cells is communicatively coupled to a respective pair of the plurality of plane selection devices.

3. The memory array of claim 1 , wherein elements of the decode logic include transistors formed in a silicon substrate material, and the plurality of plane selection devices are thin film devices.

4. The memory array of claim 1 , wherein each of the plurality of plane select devices are an ovonic threshold switch (OTS).

5. The memory array of claim 4 , wherein each of the plurality of plane select devices is a three-terminal OTS.

6. The memory array of claim 5 , wherein a first terminal of the three-terminal OTS is communicatively coupled in parallel to a group of the plurality of memory cells, a second terminal of the three-terminal OTS is communicatively coupled to the decode logic, and a third terminal of the three-terminal OTS is communicatively coupled to a plane enable control line.

7. The memory array of claim 6 , wherein the three-terminal OTS is communicatively coupled to the plane enable control line in a common base configuration.

8. The memory array of claim 6 , wherein the three-terminal OTS is communicatively coupled to the plane enable control line in a common collector configuration.

9. The memory array of claim 1 , wherein each memory cell includes a storage device and a thin film cell select device.

10. The memory array of claim 9 , wherein each memory cell is a phase change material and switch (PCMS) device.

11. The memory array of claim 10 , wherein the cell select device is a two-terminal OTS formed in series with the phase change material.

12. A method of forming a memory array, comprising:

forming decode circuitry in a substrate material;

forming at least one plane having phase change material and switch (PCMS) memory cells arranged in a matrix and a plane select device,

wherein a group of the PCMS memory cells are communicatively coupled to a conductive line, and the conductive line is communicatively coupled to the decode circuitry directly from the plane select device.

13. The method of claim 12 , wherein forming the plane select device includes forming a three-terminal ovonic threshold switch (OTS) in a common base configuration, the common base connected to a respective plane enable signal.

14. The method of claim 12 , wherein forming the plane select device includes forming a three-terminal ovonic threshold switch (OTS) in a common collector configuration, the common base connected to a respective plane enable signal.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2012
From: LEE, JONG-WON; SPADINI, GIANPAOLO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 028867/0499 →
Continuity (1)
Related Publication 20140063888A1 · Mar 6, 2014