Etching apparatus and method
An etchant is supplied to a workpiece. Furthermore, the workpiece is irradiated with spatially modulated light to adjust a temperature profile of said workpiece while etchant is supplied.
1. An apparatus comprising:
a workpiece holder;
an etchant supply configured to supply etchant to a workpiece held by said workpiece holder;
a radiation source;
a spatial radiation modulator configured to spatially modulate radiation emitted from said radiation source to said workpiece; and
a control unit configured to control said spatial radiation modulator to establish a desired temperature profile on said workpiece while etchant is supplied to said workpiece.
2. The apparatus of claim 1 , wherein said radiation source has a power sufficient to irradiate said workpiece with a power density of at least 1 W/cm 2 .
3. The apparatus of claim 1 , further comprising a measurement device configured to measure a thickness profile of said workpiece.
4. The apparatus of claim 3 , wherein said measurement device is configured to perform at least one of a capacitive measurement, an optical triangulation or an interference based measurement.
5. The apparatus of claim 3 , wherein said control unit is configured to control said spatial radiation modulator based on a measurement result of said measurement device.
6. The apparatus of claim 1 , wherein said workpiece holder is rotatable.
7. The apparatus of claim 6 , wherein said radiation source and said spatial radiation modulator are arranged to irradiate said workpiece on said workpiece holder only on one side of a rotation axis of said workpiece holder.
8. The apparatus of claim 1 , wherein said spatial radiation modulator comprises at least one of a micromirror array or a liquid crystal display array.
9. An apparatus comprising:
a rotatable chuck;
an etchant dispenser arranged above said chuck;
a high power light source; and
a light modulator arranged between said high power light source and at least part of said chuck to control a temperature of a workpiece on said chuck.
10. The apparatus of claim 9 , wherein said chuck comprises a channel for establishing a gas cushion between said workpiece and said chuck.
11. The apparatus of claim 9 , wherein said light modulator is arranged on one side of a rotation axis of said chuck.
12. The apparatus of claim 9 , wherein said dispenser is movable in a direction parallel to a surface of said chuck.
13. The apparatus of claim 9 , wherein said high power light source has a power capable of irradiating said chuck with a power density of at least 1 W/cm 2 .
14. The apparatus of claim 9 , wherein said light modulator comprises a digital light processing (DLP) chip.