IP Library › Granted Patent US 9,147,591
Granted Patent B2
US 9,147,591 · App. 14/004,953 · Granted Sep 29, 2015

Substrate processing apparatus

Inventor: Sensho Kobayashi (Yamanashi, JP)
Assignee: Tokyo Electron Limited
H01L21/67703H01L21/67173H01L21/67184H01L21/67201
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Quick Facts
Patent No.
US 9,147,591
App. No.
14/004,953
Granted
Sep 29, 2015
Kind
B2
Abstract

A substrate processing apparatus includes a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules arranged near the vacuum transfer modules that are configured to process the substrate under a reduced-pressure atmosphere; one or more load lock modules provided at each of the vacuum transfer modules; a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one load lock module; and a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another load lock module. The second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one load lock module, and the vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.

Claims (13)

1. A substrate processing apparatus comprising:

a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules that are configured to process the substrate under a reduced-pressure atmosphere, the process modules being arranged near the vacuum transfer modules;

one or more load lock modules provided at each vacuum transfer module of the plurality of vacuum transfer modules, the load lock modules being configured to switch an internal atmosphere between an air atmosphere and a reduced-pressure atmosphere and pass the substrate to and from the vacuum transfer modules;

a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one of the load lock modules; and

a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another one of the load lock modules;

wherein the second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one of the load lock modules; and

wherein the plurality of vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.

2. The substrate processing apparatus as claimed in claim 1 , wherein the plurality of vacuum transfer modules are arranged in series along the substrate transfer direction of the second atmosphere transfer mechanism on both sides of opposing side walls of the second atmosphere transfer mechanism.

3. The substrate processing apparatus as claimed in claim 1 , wherein the other one of the load lock modules includes a first opening part for transferring the substrate to/from the second atmosphere transfer mechanism; a second opening part for transferring the substrate to/from the vacuum transfer module that is provided with the other one of the load lock modules; an elevating mechanism for raising and lowering the substrate;

and a transfer robot that transfers the substrate via the first opening part and the second opening part.

4. The substrate processing apparatus as claimed in claim 3 , wherein the plurality of vacuum transfer modules are arranged to have substantially the same height in a vertical direction with respect to an installation face of the substrate processing apparatus.

5. The substrate processing apparatus as claimed in claim 1 , wherein the second atmosphere transfer mechanism is accommodated within an atmosphere transfer module; and the atmosphere transfer module includes a blower unit that blows cleaning air.

6. The substrate processing apparatus as claimed in claim 1 , wherein the second atmosphere transfer mechanism includes a plurality of atmosphere transfer mechanisms that overlap with one another in planar view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2013
From: KOBAYASHI, SENSHO
To: TOKYO ELECTRON LIMITED
Reel/Frame 031200/0961 →
Priority Claims (1)
JP 2011-069016 · Mar 26, 2011 · national
Continuity (1)
Related Publication 20140003891A1 · Jan 2, 2014