Memory cells and methods of forming memory cells
Some embodiments include a memory cell having an electrode and a switching material over the electrode. The electrode is a first composition which includes a first metal and a second metal. The switching material is a second composition which includes the second metal. The second composition is directly against the first composition. Some embodiments include methods of forming memory cells.
1. A memory cell, comprising:
an electrode;
a switching material over and directly against the electrode;
an ion reservoir material over the switching material;
wherein the electrode comprises a first composition which includes a first metal and a second metal, and the switching material comprises a second composition which includes the second metal; the second composition being directly against the first composition; and
wherein:
the first composition is TiAlN, where the formula lists primary elements rather than designates a specific stoichiometry; and
the second composition is AlO, where the formula lists primary elements rather than designates a specific stoichiometry.
2. The memory cell of claim 1 where an atomic ratio of Ti:Al within the first composition is within a range of from about 5:1 to about 2:1.
3. The memory cell of claim 1 where the TiAlN has a stoichiometry of Ti (1-x) Al (x) N, with x being within a range of from about 0.15 to about 0.35.
4. A memory cell, comprising:
an electrode;
a switching material over and directly against the electrode;
an ion reservoir material over the switching material;
wherein the electrode comprises a first composition which includes a first metal and a second metal, and the switching material comprises a second composition which includes the second metal; the second composition being directly against the first composition; and
wherein:
the first composition comprises M 1 M 2 N, where M 1 and M 2 are metals and the formula lists primary elements rather than designates a specific stoichiometry; and
the second composition comprises M 2 O, where M 2 is the metal and the formula lists primary elements rather than designates a specific stoichiometry.
5. The memory cell of claim 4 where M 1 is Ti; and where M 2 is one or more of W, Ta, Hf, Zr and Al.
6. A memory cell, comprising:
an electrode;
a switching material over the electrode and directly against the electrode along an interface;
an ion reservoir material over the switching material;
wherein the switching material comprises an oxide at the interface;
wherein the electrode comprises a nitride at the interface; and
wherein the nitride includes at least two different metals, with at least one of said at least two different metals not being present in the oxide, and with at least one of said at least two different metals being present in the oxide.
7. The memory cell of claim 6 wherein the nitride and oxide both comprise one or more of Al, Hf, Zr, Ta and W.
8. The memory cell of claim 7 wherein only the nitride comprises Ti.
9. The memory cell of claim 6 wherein the nitride and oxide both comprise Al.
10. The memory cell of claim 6 wherein the nitride and oxide both comprise Hf.
11. The memory cell of claim 6 wherein the nitride and oxide both comprise Zr.
12. The memory cell of claim 6 wherein the nitride and oxide both comprise Ta.
13. The memory cell of claim 6 wherein the nitride and oxide both comprise W.
14. The memory cell of claim 6 wherein the nitride and oxide both comprise Al; wherein only the nitride comprises Ti; and wherein an atomic ratio of Ti:Al within the nitride is within a range of from about 5:1 to about 2:1.
15. A method of forming a memory cell, comprising:
forming a first electrode to comprise a first composition containing a first metal and a second metal;
forming a switching material over the first electrode and directly against the first composition at an interface; the switching material comprising a second composition at the interface with the second composition containing the second metal;
forming an ion reservoir material over the switching material;
forming a second electrode over the ion reservoir material; and
wherein:
the first composition is TiAlN, where the formula lists primary elements rather than designates a specific stoichiometry; and
the second composition is AlO, where the formula lists primary elements rather than designates a specific stoichiometry.
16. A method of forming a memory cell, comprising:
forming a first electrode to comprise a first composition containing a first metal and a second metal;
forming a switching material over the first electrode and directly against the first composition at an interface; the switching material comprising a second composition at the interface with the second composition containing the second metal;
forming an ion reservoir material over the switching material;
forming a second electrode over the ion reservoir material; and
wherein:
the first composition is M 1 M 2 N, where M 1 and M 2 are metals and the formula lists primary elements rather than designates a specific stoichiometry; and
the second composition is M 2 O, where M 2 is the metal and the formula lists primary elements rather than designates a specific stoichiometry.
17. The method of claim 16 where M 1 comprises Ti; and where M 2 comprises one or more of W, Ta, Hf, Zr and Al.