IP Library › Granted Patent US 9,171,903
Granted Patent B2
US 9,171,903 · App. 13/897,112 · Granted Oct 27, 2015

Transistors having features which preclude straight-line lateral conductive paths from a channel region to a source/drain region

Inventor: Michael A. Smith (Boise, ID)
Assignee: Micron Technology, Inc.
H01L29/1033H01L29/78
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Quick Facts
Patent No.
US 9,171,903
App. No.
13/897,112
Granted
Oct 27, 2015
Kind
B2
Abstract

Some embodiments include transistors having a channel region under a gate, having a source/drain region laterally spaced from the channel region by an active region, and having one or more dielectric features extending through the active region in a configuration which precludes any straight-line lateral conductive path from the channel region to the source/drain region. The dielectric features may be spaced-apart islands in some configurations. The dielectric features may be multi-branched interlocking structures in some configurations.

Claims (28)

1. A transistor comprising:

a channel region under a gate;

a source/drain region laterally spaced from the channel region by an active region;

one or more dielectric features extending through the active region in a configuration which precludes any straight-line lateral conductive path from the channel region to the source/drain region; and

wherein the dielectric features are configured as spaced-apart interlocking structures.

2. A transistor comprising:

a channel region under a gate;

a source/drain region laterally spaced from the channel region by an active region;

one or more dielectric features extending through the active region in a configuration which precludes any straight-line lateral conductive path from the channel region to the source/drain region; and

wherein the source/drain region is a first source/drain region on one side of the gate, and further comprising a second source/drain region on an opposing side of the gate from said first source/drain region; wherein the active region is a first active region on one side of the gate, and further comprising a second active region on an opposing side of the gate from the first active region, wherein the dielectric features are first dielectric features within the first active region, and further comprising second dielectric features within the second active region.

3. The transistor of claim 2 wherein the second dielectric features within the second active region mirror the first dielectric features within the first active region.

4. The transistor of claim 2 wherein the second dielectric features within the second active region do not mirror the first dielectric features within the first active region.

5. A transistor comprising:

a channel region under a gate;

a source/drain region laterally spaced from the channel region by an active region;

multiple spaced-apart dielectric features corresponding to dielectric islands extending through the active region in a configuration which precludes any straight-line lateral conductive path from the channel region to the source/drain region; and

wherein the source/drain region is a first source/drain region on one side of the gate, and further comprising a second source/drain region on an opposing side of the gate from said first source/drain region; wherein the active region is a first active region on one side of the gate, and further comprising a second active region on an opposing side of the gate from the first active region, wherein the dielectric features are first dielectric features within the first active region, and further comprising second dielectric features within the second active region.

6. The transistor of claim 5 wherein the second dielectric features within the second active region mirror the first dielectric features within the first active region.

7. The transistor of claim 5 wherein the second dielectric features within the second active region do not mirror the first dielectric features within the first active region.

8. A transistor comprising:

a channel region under a gate;

a source/drain region laterally spaced from the channel region by an active region; and

interlocking multi-branched dielectric features extending through the active region in a configuration which precludes any straight-line lateral conductive path from the channel region to the source/drain region.

9. The transistor of claim 8 being a high-voltage transistor.

10. The transistor of claim 8 wherein the source/drain region is a first source/drain region on one side of the gate, and further comprising a second source/drain region on an opposing side of the gate from said first source/drain region; wherein the active region is a first active region on one side of the gate, and further comprising a second active region on an opposing side of the gate from the first active region, wherein the dielectric features are first dielectric features within the first active region, and wherein there are no dielectric features within the second active region.

11. The transistor of claim 8 wherein the source/drain region is a first source/drain region on one side of the gate, and further comprising a second source/drain region on an opposing side of the gate from said first source/drain region; wherein the active region is a first active region on one side of the gate, and further comprising a second active region on an opposing side of the gate from the first active region, wherein the dielectric features are first dielectric features within the first active region, and further comprising second dielectric features within the second active region.

12. The transistor of claim 11 wherein the second dielectric features within the second active region mirror the first dielectric features within the first active region.

13. The transistor of claim 11 wherein the second dielectric features within the second active region do not mirror the first dielectric features within the first active region.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2013
From: SMITH, MICHAEL A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030444/0910 →
Continuity (1)
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