Camera module
Embodiments of the invention provide a camera module including a lens barrel part in which a plurality of lenses are stacked, a housing having the lens barrel part disposed therein, and an infrared (IR)-cut filter provided in the housing and disposed at a lower portion of the lens barrel part. According to at least one embodiment, the camera module further includes a circuit board having a window formed therein so as to penetrate through a central region thereof and supporting a bottom surface of the housing; an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal, and a plate coupled to a lower portion of the circuit board to radiate heat generated from the circuit board.
1. A camera module comprising:
a lens barrel part in which a plurality of lenses are stacked;
a housing having the lens barrel part disposed therein;
an infrared (IR)-cut filter provided in the housing and disposed at a lower portion of the lens barrel part;
a circuit board having a window formed therein so as to penetrate through a central region thereof;
an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal; and
a plate coupled to a lower portion of the circuit board to radiate heat generated from the circuit board,
wherein the housing comprises one or more foot parts extended vertically downwardly at edge circumferences of a bottom surface of the housing and a guide pin vertically downwardly protruding on a lower surface of each foot part,
wherein the circuit board comprises one or more notches formed at positions corresponding to those of the foot parts of the housing, and
wherein the plate comprises one or more accommodating grooves formed in an upper surface thereof facing the foot parts of the housing.
2. The camera module of claim 1 , wherein the circuit board has a thickness corresponding to that of the image sensor.
3. The camera module of claim 1 , further comprising a wire bonding part electrically connecting the image sensor and the circuit board to each other.
4. The camera module of claim 1 , wherein the plate has a thickness thinner than that of the circuit board.
5. The camera module of claim 1 , wherein the plate is made of a steel or copper material.
6. The camera module of claim 1 , wherein the plate is made of a thermal conductive material.
7. The camera module of claim 1 , wherein an upper surface of the circuit board is disposed on the same plane as an upper surface of the image sensor.
8. The camera module of claim 1 , wherein the notches are formed at edge circumferences of the circuit board.
9. The camera module of claim 1 , wherein the foot parts of the housing directly contact the plate.
10. The camera module of claim 1 , wherein the foot parts are formed at corners of the housing, and
the notches are formed at corners of the circuit board.
11. The camera module of claim 1 , wherein the foot part have a length part that is the same as or shorter than a thickness of the circuit board.
12. The camera module of claim 1 , wherein the guide pin has a length part that is the same as or shorter than a depth of the accommodating groove.
13. The camera module of claim 1 , wherein the accommodating grooves are formed by perforating the plate in a thickness direction.
14. The camera module of claim 1 , wherein the housing has a concave shaped part formed in a bottom surface of one side thereof.
15. The camera module of claim 14 , wherein the bottom surface of the housing except for the concave shaped part directly contacts the plate.
16. The camera module of claim 15 , wherein the plate is formed so as to have an area larger than that of the bottom surface of the housing.
17. A camera module comprising:
a lens barrel part in which a plurality of lenses are stacked;
a housing having the lens barrel part disposed therein;
an IR-cut filter provided in the housing and disposed at a lower portion of the lens barrel part;
a circuit board having a window formed therein so as to penetrate through a central region thereof and disposed at a lower portion of the housing;
an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal; and
a plate disposed on a lower portion of the circuit board and directly contacting a portion of a bottom surface of the housing,
wherein the housing comprises one or more foot parts extended vertically downwardly at edge circumferences of a bottom surface of the housing and a guide pin vertically downwardly protruding on a lower surface of each foot part,
wherein the circuit board comprises on or more notches, formed at positions corresponding to those of the foot part of the housing, and
wherein the plate comprises one or more accommodating grooves formed in an upper surface thereof facing the foot parts of the housing.
18. The camera module of claim 17 , wherein the plate supports the image sensor disposed in the window of the circuit board.
19. The camera module of claim 17 , wherein an upper surface of the circuit board is disposed on the same plane as an upper surface of the image sensor.