Module substrate, module-substrate manufacturing method, and terminal connection substrate
In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate.
1. A module substrate comprising:
a base substrate;
a plurality of electronic components mounted on at least a single side of the base substrate; and
a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on the insulator; wherein
the plurality of terminal connection substrates is mounted on the base substrate such that a single end side of each of the plurality of columnar terminal electrodes is in contact with the base substrate;
the plurality of columnar terminal electrodes of each of the plurality of terminal connection substrates is disposed on two opposed outermost exposed lateral surfaces of the insulator so as to be spaced apart from one another along each of the two opposed outermost exposed lateral surfaces of the insulator;
the plurality of columnar terminal electrodes extend outward from each of the two opposed outermost exposed lateral surfaces of the insulator; and
the insulator extends along only an edge portion of the base substrate.
2. The module substrate according to claim 1 , wherein the plurality of columnar terminal electrodes of the plurality of terminal connection substrates is arranged in a line on each of the two opposed outermost exposed lateral surfaces of the respective insulator.
3. The module substrate according to claim 1 , wherein a resist is provided between the plurality of terminal electrodes in the terminal connection substrate.
4. The module substrate according to claim 1 , wherein the plurality of electronic components and the plurality of terminal connection substrates mounted on the base substrate are sealed with resin, and the resin has an identical composition to that of the insulator.
5. A terminal connection substrate in which a plurality of columnar terminal electrodes is arranged on an insulator; wherein
the plurality of columnar terminal electrodes is disposed on two opposed outermost exposed lateral surfaces of the insulator so as to be spaced apart from one another along each of the two opposed outermost exposed lateral surfaces of the insulator;
the plurality of columnar terminal electrodes are disposed on and extend outward from each of the two opposed outermost exposed lateral surfaces of the insulator; and
the insulator is configured to extend along only an edge portion of a base substrate.