Wire bonded light emitting diode (LED) components including reflective layer
View Patent ↗A Light Emitting Diode (LED) component includes an LED die having first and second opposing faces and a sidewall. A contact is provided that is spaced apart from the LED die. The contact includes an inner face adjacent the first face and an outer face adjacent the second face. The contact may be a portion of a lead frame or a discrete contact slug. A wire bond extends between the first face and the inner face. A reflective layer is provided on the inner face that extends to the sidewall and also extends along the sidewall. The reflective layer may include white paint. Related fabrication methods are also described.
1. A Light Emitting Diode (LED) component comprising:
an LED die that comprises first and second opposing faces and a die sidewall extending therebetween;
a contact that is spaced apart from the LED die, the contact comprising an inner face adjacent the first face and an outer face adjacent the second face;
a wire bond that extends between the first face and the inner face; and
a reflective layer on the inner face that extends to the die sidewall and also extends along the die sidewall,
wherein the reflective layer includes an outer surface that is coplanar with the first face.
2. An LED component according to claim 1 further comprising:
a solder layer on the second face.
3. An LED component according to claim 1 further comprising:
a layer comprising luminophoric material on the first face, wherein the reflective layer does not extend onto the first face.
4. An LED component according to claim 1 further comprising a layer comprising luminophoric material on the first face and extending onto the outer surface.
5. A Light Emitting Diode (LED) component comprising:
an LED die that comprises first and second opposing faces and a die sidewall extending therebetween;
a contact that is spaced apart from the LED die, the contact comprising an inner face adjacent the first face and an outer face adjacent the second face;
a wire bond that extends between the first face and the inner face; and
a reflective layer on the inner face that extends to the die sidewall and also extends along the die sidewall,
wherein the contact comprises a portion of a lead frame, the lead frame comprising a conductive layer including therein the contact, another contact and a severable interconnection that connects the contact and the another contact.
6. An LED component according to claim 5 wherein the contact includes a tab that extends therefrom, the tab comprising a portion of the severable interconnection.
7. An LED component according to claim 1 wherein the contact comprises a slug.
8. An LED component according to claim 7 wherein the slug comprises an insulating body, a conductive layer on opposing faces thereof, and a conductive via that extends in and/or on the insulating body to electrically connect the conductive layers on the opposing faces of the slug.
9. An LED component according to claim 7 wherein the slug comprises a copper slug having a reflective metal layer on opposing faces thereof.
10. An LED component according to claim 7 wherein the slug comprises a portion of a wire and/or a solder slug.
11. An LED component according to claim 1 further comprising an optically transparent structure on the reflective layer and on the first face.
12. An LED component according to claim 11 wherein the optically transparent structure comprises an encapsulation layer on the reflective layer and on the first face and a glass layer on the encapsulation layer, remote from the reflective layer and the first face.
13. An LED component according to claim 1 on a board along with other electronic components, wherein the LED component is free of a submount between the LED die and the board.
14. An LED component according to claim 1 wherein the reflective layer comprises white paint.
15. An LED component according to claim 1 wherein the contact is a first contact and the wire bond is a first wire bond, the LED component further comprising:
a second contact that is spaced apart from the LED die and the first contact, the second contact also comprising an inner face adjacent the first face and an outer face adjacent the second face; and
a second wire bond that extends between the first face and the inner face of the second contact,
wherein the reflective layer also extends on the inner face of the second contact.
16. A Light Emitting Diode (LED) component comprising:
an LED die that comprises first and second opposing faces and a die sidewall extending therebetween;
a slug that is spaced apart from the LED die, the slug comprising an inner face adjacent the first face and an outer face adjacent the second face;
a wire bond that extends between the first face and the inner face;
a first solder structure on the second face and including a first solder structure sidewall;
a second solder structure on the outer face and including a second solder structure sidewall that faces the first solder structure sidewall; and
a reflective layer that extends between the first solder structure sidewall and the second solder structure sidewall.
17. An LED component according to claim 16 further comprising:
a layer comprising luminophoric material on the first face, on the die sidewall, on the reflective layer and on the inner face.
18. An LED component according to claim 16 wherein the slug comprises an insulating body, a conductive layer on opposing faces thereof, and a conductive via that extends in and/or on the insulating body to electrically connect the conductive layers on the opposing faces of the slug.
19. An LED component according to claim 16 wherein the slug comprises a copper slug having a reflective metal layer on opposing faces thereof.
20. An LED component according to claim 16 wherein the slug comprises a portion of a wire and/or a solder slug.
21. An LED component according to claim 17 further comprising an optically transparent structure on the layer comprising luminophoric material.
22. An LED component according to claim 21 wherein the optically transparent structure comprises an encapsulation layer on the layer comprising luminophoric material and a glass layer on the encapsulation layer.
23. An LED component according to claim 16 on a board along with other electronic components, wherein the LED component is free of a submount between the LED die and the board.
24. An LED component according to claim 16 wherein the reflective layer comprises white paint.
25. An LED component according to claim 16 wherein the slug is a first slug and the wire bond is a first wire bond, the LED component further comprising:
a second slug that is spaced apart from the LED die and the first slug, the second slug also comprising an inner face adjacent the first face and an outer face adjacent the second face;
a second wire bond that extends between the first face and the inner face of the second slug; and
a third solder structure on the outer face of the second slug and including a third solder structure sidewall that faces the first and/or second solder structure sidewalls;
wherein the reflective layer also extends between the third solder structure sidewall and the first and/or second solder structure sidewalls.
26. An LED component according to claim 5 further comprising a layer comprising luminophoric material on the first face and extending onto the outer surface.
27. An LED component according to claim 5 further comprising an optically transparent structure on the reflective layer and on the first face.