Semiconductor package having heat dissipating member
A semiconductor package includes a substrate having an upper surface and a lower surface, a semiconductor chip which is mounted on the upper surface of the substrate, and in an upper surface of which a first recess portion is provided, a molding member formed such that the molding member exposes the upper surface of the semiconductor chip and covers the semiconductor chip on the upper surface of the substrate, and a first heat dissipating member formed in the first recess portion, wherein the first heat dissipating member includes moisture absorption particles and a heat dissipation molding member.
1. A semiconductor package comprising:
a substrate having an upper surface and a lower surface;
a semiconductor chip mounted on the upper surface of the substrate, the semiconductor chip including an upper surface, and the upper surface including a first recess portion;
a molding member that exposes the upper surface of the semiconductor chip and is disposed between the semiconductor chip and the upper surface of the substrate; and
a first heat dissipating member formed in the first recess portion, wherein the first heat dissipating member comprises at least one moisture absorption particle and a heat dissipation molding member.
2. The semiconductor package of claim 1 , wherein the upper surface of the semiconductor chip comprises a protrusion portion defined by the first recess portion, and the protrusion portion has a matrix structure.
3. The semiconductor package of claim 1 , wherein the first recess portion has a depth that is equal to or less than 100 μm.
4. The semiconductor package of claim 1 , further comprising:
a second recess portion provided on an upper surface of the molding member; and
a second heat dissipating member formed in the second recess portion.
5. The semiconductor package of claim 1 , wherein the moisture absorption particle absorbs moisture around the semiconductor package at room temperature.
6. The semiconductor package of claim 1 , wherein the moisture absorption particles is formed from at least one of sodium polyacrylate, polyacrylic alcohol-based copolymer, polyacryl amide, potassium polyacrylate, polyacrylic acid, silica gel, molecular sieve, montmorillonite clay, and zeolite.
7. The semiconductor package of claim 1 , wherein the heat dissipating molding member is formed from an epoxy-group molding resin or a polyimide-group molding resin.
8. The semiconductor package of claim 1 , further comprising:
a bump interposed between the semiconductor chip and the substrate; and
the semiconductor chip is mounted on the substrate by using the bump as a medium.
9. The semiconductor package of claim 8 , further comprising an under-fill covering the bump between the semiconductor chip and the substrate.
10. The semiconductor package of claim 1 , wherein the substrate has an opening slit formed in a central portion thereof, and the semiconductor chip is mounted on the substrate in a face-down manner.
11. The semiconductor package of claim 1 , wherein an upper surface of the heat dissipating member is lower than the upper surface of the semiconductor chip.
12. The semiconductor package of claim 1 , wherein an upper surface of the heat dissipating member is located at the same height as the upper surface of the semiconductor chip.
13. The semiconductor package of claim 1 , wherein an upper surface of the heat dissipating member is higher than the upper surface of the semiconductor chip.
14. A semiconductor package comprising:
a substrate having an upper surface and a lower surface;
a semiconductor chip mounted on the upper surface of the substrate;
a molding member which is formed such that the molding member covers an upper surface and a side surface of the semiconductor chip on the upper surface of the substrate, and in an upper surface of which a recess portion is formed; and
a heat dissipating member formed in the recess portion, wherein the heat dissipating member comprises a plurality of moisture absorption particles and a heat dissipation molding member.
15. The semiconductor package of claim 14 , wherein a lower surface of the recess portion is higher than the upper surface of the semiconductor chip.
16. A semiconductor package comprising:
a substrate;
at least one semiconductor device, the at least one semiconductor device mounted on the upper surface of the substrate;
a molding member, the molding member including at least one heat dissipating member, formed such that the molding member covers an upper surface and a side surface of the semiconductor chip on the upper surface of the substrate, and in an upper surface of which a recess portion is formed, the at least one heat dissipating member formed in the recess portion and
the heat dissipating member including a plurality of moisture absorption particles and a heat dissipation molding member; and wherein the at least one semiconductor device includes a plurality of semiconductor devices arranged in a stacked manner.
17. The semiconductor package of claim 16 , wherein the semiconductor device includes at least one heat dissipating member disposed on an upper surface of the semiconductor device.
18. The semiconductor package of claim 16 , wherein
the molding member covers the exposed surfaces of the plurality of semiconductor devices.
19. The semiconductor package of claim 16 , wherein the moisture absorption particles are formed from a moisture absorption substance.
20. The semiconductor package of claim 16 , wherein the molding member defines the exposed surface of the semiconductor device.