Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings
A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing.
1. An integrated circuit (IC) device tester configured to maintain a set point temperature on an IC device under test (DUT) having a die attached to a substrate, the tester comprising:
a test socket assembly having:
a test socket with an opening configured to accommodate an IC device under test (DUT);
a set of receptacle holes configured to align the test socket with a mounting mechanism for placing and removing the DUT;
a corresponding set of bushings configured to be placed inside each of the receptacle holes to ensure the alignment of the DUT, and wherein at least one of the set of bushings has a semi-circular channel around an outer circumference; and
at least two retaining pins configured to be operatively coupled to the at least one bushing of the test socket, wherein external profiles of the retaining pins compliment the semi-circular channel around the outer circumference of the at least one bushing, and wherein the retaining pins are configured to be tangentially oriented relative to both the at least one bushing and a corresponding one of the receptacle holes, thereby securing the at least one at least one bushing to the corresponding receptacle hole;
a test pedestal assembly configured to contact a die of the DUT;
a heat exchange plate configured to facilitate the heat conduction to and from the heat-conductive test pedestal assembly and having an attached temperature sensor for monitoring the temperature;
a temperature-control fluid circulation block having a fluid inlet and a fluid outlet configured to circulate a fluid therethrough, the block in stacked relationship along a z-axis with the heat conductive test pedestal assembly;
a thermally-conductive heater between the heat exchange plate and the fluid circulation block configured to provide heat to the test pedestal assembly through heat exchange plate;
a substrate pusher configured to contact the substrate of the DUT; and
a controllable force distributor configured to receive a z-axis force and controllably distribute such z-axis force between the test pedestal assembly and the substrate pusher.
2. The tester of claim 1 wherein the at least two retaining pins are partially threaded dowel pins and configured to be removably screwed in and out of the socket, thereby enabling the at least one bushing placed inside the corresponding receptacle hole to be replaced as the at least one bushing wears out or becomes deformed from repeated use.