IP Library Granted Patent US 9,282,684
Granted Patent B2
US 9,282,684 · App. 13/596,798 · Granted Mar 8, 2016

Cooling systems for electrical equipment

Inventors: Earl Keisling (Ridgefield, CT); John Costakis (Hyde Park, NY); Gerald McDonneli (Poughquag, NY)
Assignee: INERTECH IP LLC
H05K7/20827F25B49/00F25D17/00F28D15/00G06F1/20H01L23/34H01L23/473H05K7/20218H05K7/20763H05K7/20781H01L2924/0002
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Quick Facts
Patent No.
US 9,282,684
App. No.
13/596,798
Granted
Mar 8, 2016
Kind
B2
Abstract

A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

Claims (23)

1. A cooling system for electrical equipment, comprising:

a first cooling circuit including a primary cooling device;

a heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit; and

a second cooling circuit coupled to the heat exchange member, the second cooling circuit including a secondary cooling device that cools fluid flowing through the second cooling circuit,

wherein the first cooling circuit includes two supply lines and two return lines in a reverse-return configuration.

2. The cooling system according to claim 1 , wherein the secondary cooling device cools a portion of a heat load associated with the electrical equipment that the primary cooling device cannot cool.

3. The cooling system according to claim 1 , wherein the secondary cooling device cools a portion of a heat load associated with the electrical equipment as a function of atmospheric conditions.

4. The cooling system according to claim 1 , further comprising primary cooling coils in thermal communication with the electrical equipment.

5. The cooling system according to claim 1 , wherein the secondary cooling device operates to cool the electrical equipment when a wet bulb temperature of the atmosphere associated with the environment of the electrical equipment exceeds a predetermined wet bulb temperature.

6. The cooling system according to claim 1 , wherein the fluid flowing through the first cooling circuit is a glycol solution or water and wherein the fluid flowing through the second cooling circuit is a refrigerant.

7. The cooling system according to claim 1 , further comprising:

a second heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit; and

a third cooling circuit coupled to the second heat exchange member, the third cooling circuit including a second secondary cooling device that cools fluid flowing through the third cooling circuit.

8. The cooling system according to claim 7 , further comprising secondary cooling coils in thermal communication with the electrical equipment.

9. The cooling system according to claim 1 , wherein the primary cooling device is a free-cooling device.

10. The cooling system according to claim 9 , wherein the free-cooling device includes a fluid cooler.

11. A cooling system for electrical equipment, comprising:

a first cooling circuit including a primary cooling device;

a heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit;

a second cooling circuit coupled to the heat exchange member, the second cooling circuit including a secondary cooling device that cools fluid flowing through the second cooling circuit; and

a third cooling circuit coupled to the second cooling circuit, the third cooling circuit including a cooling fluid source and an expansion tank.

12. The cooling system according to claim 1 , wherein the heat exchange member is a condenser.

13. The cooling system according to claim 10 , wherein the fluid cooler is a cooling tower.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2018
From: TELL/AE LENDER, LLC
To: ALIGNED ENERGY, LLC; INERTECH IP LLC; KARBON ENGINEERING, LLC; ENERGY METRICS, LLC
Reel/Frame 045396/0553 →
RELEASE OF SECURITY INTEREST Recorded Nov 18, 2014
From: JABIL CIRCUIT, INC.
To: ALIGNED ENERGY, LLC; INERTECH IP LLC; KARBON ENGINEERING, LLC; ENERGY METRICS, LLC
Reel/Frame 034197/0254 →
SECURITY AGREEMENT Recorded Nov 18, 2014
From: ALIGNED ENERGY, LLC; KARBON ENGINEERING, LLC; ENERGY METRICS, LLC; INERTECH IP, LLC
To: TELL/AE LENDER, LLC
Reel/Frame 034286/0726 →
SECURITY INTEREST Recorded Jul 10, 2014
From: INERTECH IP, LLC
To: JABIL CIRCUIT, INC.
Reel/Frame 033293/0118 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2014
From: KEISLING, EARL; COSTAKIS, JOHN; MCDONNELL, GERALD
To: INERTECH IP LLC
Reel/Frame 033252/0543 →
Continuity (7)
Continuation 13338987 · Dec 28, 2011
Continuation In Part PCTUS2011041710 · Jun 23, 2011
Provisional Application 61357851 · Jun 23, 2010
Provisional Application 61414279 · Nov 16, 2010
Provisional Application 61448631 · Mar 2, 2011
Provisional Application 61482070 · May 3, 2011
Related Publication 20120318492A1 · Dec 20, 2012