Plasma etching method and plasma etching apparatus

1. A plasma etching method of etching a substrate having thereon a target film, the target film including an organic film not containing Si (silicon) or the target film including an amorphous carbon (a-C) film, and a mask film and a resist film having a preset pattern which are formed on top of each other in sequence, the plasma etching method comprising:

etching the mask film with the resist film as a mask; and

etching the target film including the organic film not containing the Si or the target film including the amorphous carbon (a-C) film by plasma of a mixture gas containing O 2 (oxygen), COS (carbonyl sulfide) and Cl 2 (chlorine) with the resist film and the mask film as a mask to form a groove in the target film,

wherein a ratio of a flow rate of the COS to a flow rate of the Cl 2 is set to be in a range from about 0.35 to about 0.5 such that a slope is formed on an inner wall of the groove to allow a width of an opening of the groove to be larger than a width of a bottom of the groove and that a taper angle is in a range from about 84° to about 89° with respect to the ratio of the flow rate of the COS to the flow rate of the Cl 2 .

2. The plasma etching method of claim 1 ,

wherein the ratio of the flow rate of the COS to the flow rate of the Cl 2 is in a range from about 0.35 to about 0.45.

3. The plasma etching method of claim 1 ,

wherein a ratio of a flow rate of the O 2 to a sum of flow rates of the COS and the Cl 2 is in a range from about 1.5 to about 2.7.

4. The plasma etching method of claim 3 ,

wherein the ratio of the flow rate of the O 2 to the sum of the flow rates of the COS and the Cl 2 is in a range from about 1.7 to about 1.9.