Overlay metrology system and method
Overlay metrology systems are provided which include, for instance: a first metrology pattern including at least two first pairs of sub-patterns, at least one sub-pattern lacking 90 degree rotational symmetry, and a first center position for the first metrology pattern being determinable in an X-Y coordinate layout from the at least two first pairs of sub-patterns; and a second metrology including at least two second pairs of sub-patterns, at least one sub-pattern lacking 90 degree rotational symmetry, and a second center position for the second metrology pattern being determinable in the X-Y coordinate layout from the at least two second pairs of sub-patterns. Methods of making overlay metrology systems are also provided, which include, for instance, providing a first metrology pattern and a second metrology pattern, and arranging the metrology patterns in relation to each other within the X-Y coordinate layout.
1. A system comprising:
a first metrology pattern for a first circuit structure field, the first metrology pattern comprising at least two first pairs of sub-patterns, at least one sub-pattern of the at least two first pairs of sub-patterns lacking 90 degree rotational symmetry, and a first center position for the first metrology pattern being determinable in an X-Y coordinate layout, wherein one first pair of sub-patterns of the at least two first pairs of sub-patterns independently determines an X coordinate of the first center position and another first pair of sub-patterns of the at least two first pairs of sub-patterns independently determines a Y coordinate of the first center position; and
a second metrology pattern for a second circuit structure field, the second metrology pattern comprising at least two second pairs of sub-patterns, at least one sub-pattern of the at least two second pairs of sub-patterns lacking 90 degree rotational symmetry, and a second center position for the second metrology pattern being determinable in the X-Y coordinate layout, wherein one second pair of sub-patterns of the at least two second pairs of sub-patterns independently determines an X coordinate of the second center position and another second pair of sub-patterns of the at least two second pairs of sub-patterns independently determines a Y coordinate of the second center position.
2. The system of claim 1 , wherein the X-Y coordinate layout facilitates an arrangement of the first metrology pattern in relation to the second metrology pattern, the arrangement facilitating independent comparison of the X coordinate of the first center position of the first metrology pattern with the X coordinate of the second center position of the second metrology pattern, and the arrangement facilitating independent comparison of the Y coordinate of the first center position of the first metrology pattern with the Y coordinate of the second center position of the second metrology pattern.
3. The system of claim 2 , wherein the arrangement nests the first metrology pattern with the second metrology pattern so that the first center position and the second center position are designed to coincide at a same point in the X-Y coordinate layout, and wherein one or more positional deviations between the first center position and the second center position indicate an overlay error between the first circuit structure field and the second circuit structure field.
4. The system of claim 3 , further comprising at least one additional metrology pattern for at least one additional circuit structure field, the at least one additional metrology pattern comprising at least two additional pairs of sub-patterns, at least one sub-pattern of the at least two additional pairs of sub-patterns lacking 90 degree rotational symmetry, and at least one additional center position for the at least one additional metrology pattern being determinable in the X-Y coordinate layout, wherein one additional pair of sub-patterns of the at least two additional pairs of sub-patterns independently determine an X coordinate of the additional center position and another additional pair of sub-patterns of the at least two additional pairs of sub-patterns independently determine a Y coordinate of the additional center position.
5. The system of claim 4 , wherein the arrangement further nests the at least one additional metrology pattern with the first metrology pattern and the second metrology pattern, wherein the at least one additional center position and first center position and second center position are designed to coincide at the same point in the X-Y coordinate layout, and wherein one or more positional deviations between the at least one additional center position and the first center position indicate an overlay error between the additional circuit structure field and the first circuit structure field, and wherein one or more positional deviations between the at least one additional center position and the second center position indicate an overlay error between the additional circuit structure field and the second circuit structure field.
6. The system of claim 3 , wherein at least one of the first and second metrology patterns is a square metrology pattern comprising two pairs of sub-patterns, wherein sub-patterns of the two pairs of sub-patterns have centers that coincide with of the square metrology pattern.
7. The system of claim 3 , wherein at least one sub-pattern of at least one of the first or second pairs of sub-patterns of at least one of the first and second metrology patterns comprises at least one periodic structure, the at least one periodic structure comprising a plurality of structural elements.
8. The system of claim 7 , wherein the plurality of structural elements are a plurality of parallel bars and a plurality of spaces, the plurality of spaces being interleaved with and separating the plurality of parallel bars.
9. The system of claim 7 , wherein the at least one periodic structure further comprises at least one structural element comprising a periodic sub-structure, the periodic sub-structure comprising a plurality of structural sub-elements.
10. The system of claim 2 , wherein the arrangement offsets the first metrology pattern from the second metrology pattern, so that the first center position and second center position are designed to be offset horizontally by a pre-defined amount X 1 in the X-Y coordinate layout and offset vertically by a pre-defined amount Y 1 in the X-Y coordinate layout when an overlay error between the first circuit structure field and the second circuit structure field is zero, and wherein one or more positional deviations from the pre-defined amount X 1 or the pre-defined amount Y 1 indicate an overlay error between the first circuit structure field and the second circuit structure field.
11. The system of claim 10 , wherein the first metrology pattern and the second metrology pattern are not designed to be nested within the arrangement.
12. The system of claim 10 , further comprising at least one additional metrology pattern for at least one additional circuit structure field, the at least one additional metrology pattern comprising at least two additional pairs of sub-patterns, at least one sub-pattern of the at least two additional pairs of sub-patterns lacking 90 degree rotational symmetry, and at least one additional center position for the at least one additional metrology pattern being determinable in the X-Y coordinate layout, wherein one additional pair of sub-patterns of the at least two additional pairs of sub-patterns independently determine an X coordinate of the additional center position and another additional pair of sub-patterns of the at least two additional pairs of sub-patterns independently determine a Y coordinate of the additional center position.
13. The system of claim 12 , wherein the arrangement offsets the at least one additional metrology pattern from the first metrology pattern and the second metrology pattern, so that the first center position and the at least one additional center position are designed to be offset horizontally by a pre-defined amount X 2 in the X-Y coordinate layout and offset vertically by a pre-defined amount Y 2 in the X-Y coordinate layout, and wherein one or more positional deviations from the pre-defined amount X 2 or the pre-defined amount Y 2 indicate an overlay error between the first circuit structure field and the at least one additional circuit structure field, and the second center position and the at least one additional center position are designed to be offset horizontally by a pre-defined amount X 3 and offset vertically by a pre-defined amount Y 3 in the X-Y coordinate layout, and wherein one or more positional deviations from the pre-defined amount X 3 or the pre-defined amount Y 3 indicate an overlay error between the second circuit structure field and the at least one additional circuit structure field.
14. The system of claim 10 , wherein at least one of the first and second metrology patterns is a square metrology pattern comprising two pairs of sub-patterns, wherein sub-patterns of the two pairs of sub-patterns occupy diagonally opposed quadrants of the square metrology pattern.
15. The system of claim 10 , wherein at least one sub-pattern of at least one of the first or second pairs of sub-patterns of at least one of the first and second metrology patterns comprises at least one periodic structure, the at least one periodic structure comprising a plurality of structural elements.
16. The system of claim 15 , wherein the plurality of structural elements are a plurality of parallel bars and a plurality of spaces, the plurality of spaces being interleaved with and separating the plurality of parallel bars.
17. The system of claim 15 , wherein the at least one periodic structure comprises at least one structural element comprising a periodic sub-structure, the periodic sub-structure comprising a plurality of structural sub-elements.
18. A method for facilitating determining overlay accuracy, comprising:
providing a first metrology pattern for a first circuit structure field, the first metrology pattern comprising at least two first pairs of sub-patterns, at least one sub-pattern of the at least two first pairs of sub-patterns lacking 90 degree rotational symmetry, and a first center position for the first metrology pattern being determinable in an X-Y coordinate layout, wherein one first pair of sub-patterns of the at least two first pairs of sub-patterns independently determine an X coordinate of the first center position and another first pair of sub-patterns of the at least two first pairs of sub-patterns independently determine a Y coordinate of the first center position;
providing a second metrology pattern for a second circuit structure field, the second metrology pattern comprising at least two second pairs of sub-patterns, at least one sub-pattern of the at least two second pairs of sub-patterns lacking 90 degree rotational symmetry, and a second center position for the second metrology pattern being determinable in the X-Y coordinate layout wherein one second pair of sub-patterns of the at least two second pairs of sub-patterns independently determine an X coordinate of the second center position and another second pair of sub-patterns of the at least two second pairs of sub-patterns independently determine a Y coordinate of the second center position; and
arranging the first metrology pattern and the second metrology pattern in relation to each other within the X-Y coordinate layout.
19. The method of claim 18 , wherein the arranging further comprises nesting the first metrology pattern with the second metrology pattern so that the first center position and the second center position are designed to coincide at a same point in the X-Y coordinate layout.
20. The method of claim 18 , wherein the arranging further comprises offsetting the first metrology pattern from the second metrology pattern, so that the first center position and second center position are designed to be offset horizontally by a pre-defined amount X 1 in the X-Y coordinate layout and offset vertically by a pre-defined amount Y 1 in the X-Y coordinate layout, and wherein the first metrology pattern and the second metrology pattern are not designed to be nested.