Resist mask processing method using hydrogen containing plasma

1. A resist mask processing method comprising:

preparing, in a processing chamber, a target object on which a patterned resist mask is formed; and

curing the patterned resist mask by generating a plasma of a hydrogen-containing gas by supplying the hydrogen-containing gas and supplying a microwave into the processing chamber,

wherein the method further comprises, before said generating the plasma of the hydrogen-containing gas, generating a plasma of a fluorine-containing gas by supplying a fluorine-containing gas and supplying the microwave into the processing chamber where the target object is accommodated.

2. The method of claim 1 , wherein the fluorine-containing gas is CH 3 F gas.

3. The method of claim 1 , wherein said generating the plasma of the fluorine-containing gas suppresses shrinkage of a line of the patterned resist mask in a lengthwise direction of the line of the patterned resist mask.

4. The method of claim 1 , wherein the hydrogen-containing gas is H 2 gas.

5. The method of claim 1 , wherein the plasma of the hydrogen-containing gas which is excited by the microwave disconnects a side chain of a material forming the patterned resist mask while suppressing disconnection of C—C bond of a main chain of the material forming the patterned resist mask.

6. The method of claim 1 , wherein the microwave is generated by a microwave generator coupled to the processing chamber.

7. The method of claim 1 , further comprising, processing the target object using the fluorine gas excited by the microwave to deposit a fluorine compound on the patterned resist mask.

8. A method for manufacturing a semiconductor device comprising:

preparing, in a processing chamber, a target object on which a laminated body is formed, wherein a patterned resist mask is formed on the laminated body;

generating a plasma of a hydrogen-containing gas by supplying the hydrogen-containing gas and supplying a microwave into the processing chamber to thereby cure the patterned resist mask;

etching the laminated body through the cured resist mask to thereby form a patterned hard mask;

removing the cured resist mask; and

etching the target object through the patterned hard mask,

wherein the method further comprises, before said generating the plasma of the hydrogen-containing gas, generating a plasma of a fluorine-containing gas by supplying a fluorine-containing gas and supplying the microwave into the processing chamber where the target object is accommodated.

9. The method of claim 8 , wherein the fluorine-containing gas is CH 3 F gas.

10. The method of claim 8 , wherein said generating the plasma of the fluorine-containing gas suppresses shrinkage of a line of the patterned resist mask in a lengthwise direction of the line of the patterned resist mask.

11. The method of claim 8 , wherein the hydrogen-containing gas is H 2 gas.

12. The method of claim 8 , wherein the plasma of the hydrogen-containing gas which is excited by the microwave disconnects a side chain of a material forming the patterned resist mask while suppressing disconnection of C—C bond of a main chain of the material forming the patterned resist mask.

13. The method of claim 8 , wherein the microwave is generated by a microwave generator coupled to the processing chamber.

14. The method of claim 8 , further comprising, processing the target object using the fluorine gas excited by the microwave to deposit a fluorine compound on the patterned resist mask.

15. The method of claim 1 , wherein at least a portion of the patterned resist mask remains after the curing is performed.