Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure
Integrated circuit devices are provided. The integrated circuit devices may include a via structure including a conductive plug, a conductive barrier layer spaced apart from the conductive plug, and an insulating layer between the conductive plug and conductive barrier layer. Related methods of forming integrated circuit devices are also provided.
1. An integrated circuit device comprising:
a semiconductor structure; and
a through-silicon-via (TSV) structure in the semiconductor structure,
wherein the TSV structure comprises:
a conductive plug;
a conductive barrier film spaced apart from the conductive plug and surrounding the conductive plug; and
an insulating thin film between the conductive plug and the conductive barrier film.
2. The integrated circuit device of claim 1 , wherein:
the conductive plug comprises a first metal; and
the conductive barrier film comprises a second metal different from the first metal.
3. The integrated circuit device of claim 1 , further comprising a via insulating film between the semiconductor structure and the conductive barrier film.
4. The integrated circuit device of claim 3 , wherein the insulating thin film comprises a first thickness and the via insulating film comprises a second thickness thicker than the first thickness.
5. The integrated circuit device of claim 1 , further comprising a conductive layer on a surface of the semiconductor structure and contacting an end of the conductive plug and an end of the conductive barrier film.
6. The integrated circuit device of claim 5 , wherein:
the end of the conductive plug comprises a first end of the conductive plug;
the end of the conductive barrier film comprises a first end of the conductive barrier film;
the surface comprises a first surface;
the conductive layer comprises a first conductive layer on the first surface; and
the integrated circuit device further comprises:
a second conductive layer on a second surface of the semiconductor structure opposite the first surface, the second conductive layer contacting a second end of the conductive plug and a second end of the conductive barrier film.
7. The integrated circuit device of claim 6 , wherein the conductive plug and the conductive barrier film are configured to be electrically connected to each other via the first conductive layer and the second conductive layer such that the conductive plug and the conductive barrier film share an equipotential state.
8. The integrated circuit device of claim 1 , wherein the conductive barrier film comprises a substantially uniform thickness in a lengthwise direction of the TSV structure.
9. The integrated circuit device of claim 1 , wherein the insulating thin film comprises a substantially uniform thickness in a lengthwise direction of the TSV structure.
10. The integrated circuit device of claim 1 , wherein:
the conductive barrier film comprises a first conductive barrier film; and
the conductive plug comprises:
a metal plug in the semiconductor structure and surrounded by the insulating thin film; and
a second conductive barrier film surrounding the metal plug between the metal plug and the insulating thin film.
11. The integrated circuit device of claim 10 , wherein:
the first conductive barrier film comprises a substantially uniform thickness in a lengthwise direction of the TSV structure; and
the second conductive barrier film comprises a variable thickness in a lengthwise direction of the TSV structure.
12. The integrated circuit device of claim 1 , wherein:
the semiconductor structure comprises a semiconductor substrate and an interlayer insulating film on the semiconductor substrate; and
the conductive plug, the insulating thin film, and the conductive barrier film each extend in the semiconductor substrate and the interlayer insulating film.
13. The integrated circuit device of claim 1 , wherein:
the semiconductor structure comprises a semiconductor substrate, an interlayer insulating film on the semiconductor substrate, and a metal interlayer insulating film on the interlayer insulating film, and
the conductive plug, the insulating thin film, and the conductive barrier film each extend in the semiconductor substrate, the interlayer insulating film, and the metal interlayer insulating film.
14. An integrated circuit device comprising:
a semiconductor structure comprising first and second portions;
a via structure between the first and second portions of the semiconductor structure, the via structure comprising:
a conductive plug;
a conductive barrier layer spaced apart from the conductive plug; and
an insulating layer between the conductive plug and conductive barrier layer.
15. The integrated circuit device of claim 14 , further comprising a conductive layer on an end of the conductive plug and an end of the conductive barrier layer.
16. The integrated circuit device of claim 15 , wherein the conductive layer extends from a surface of the first portion of the semiconductor structure to a surface of the second portion of the semiconductor structure.
17. The integrated circuit device of claim 16 , wherein the surface of the first portion of the semiconductor structure, the surface of the second portion of the semiconductor structure, the end of the conductive plug, and the end of the conductive barrier layer are substantially coplanar.
18. The integrated circuit device of claim 14 , wherein:
the via structure comprises a through-silicon-via structure;
the conductive barrier layer comprises a first conductive barrier layer;
the conductive plug comprises:
a metal plug; and
a second conductive barrier layer between the insulating layer and the metal plug; and
the second conductive barrier layer comprises a non-uniform thickness.