Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.
1. A solder joint structure on an aluminum member made of aluminum or aluminum alloy having a joint member including a solder material,
the solder joint structure comprising:
a glass layer formed on a surface of the aluminum member;
a silver (Ag) layer laminated on the glass layer; and
a solder layer laminated on the Ag layer,
wherein crystalline oxide particles are dispersed in the Ag layer.
2. The solder joint structure according to claim 1 ,
wherein the crystalline oxide particles are composed of any one or two or more of titanium oxide, silicon oxide, and zinc oxide.
3. A power module comprising: a power module substrate in which a circuit layer made of the aluminum member is disposed on one surface of an insulating layer, and a semiconductor device joined to one surface of the circuit layer,
wherein a junction between the circuit layer and the semiconductor device is the solder joint structure described in claim 1 .
4. A power module substrate with a heat sink, comprising:
a power module substrate in which a circuit layer is disposed on one surface of an insulating layer; and
a heat sink that is joined to the other surface side of the power module substrate;
wherein at least one of a joint surface of the heat sink and a joint surface of the power module substrate is composed of the aluminum member, and
a junction between the heat sink and the power module substrate is the solder joint structure described in claim 1 .