Chip on package structure and method
A system and method for packaging semiconductor device is provided. An embodiment comprises forming vias over a carrier wafer and attaching a first die over the carrier wafer and between a first two of the vias. A second die is attached over the carrier wafer and between a second two of the vias. The first die and the second die are encapsulated to form a first package, and at least one third die is connected to the first die or the second die. A second package is connected to the first package over the at least one third die.
1. A semiconductor device comprising:
a first semiconductor device with through silicon vias;
a second semiconductor device without through silicon vias;
a redistribution layer in electrical connection with the first semiconductor device, the second semiconductor device, and the vias;
a third semiconductor device over the first semiconductor device, the third semiconductor device comprising electrical connections connected to the through silicon vias, wherein the third semiconductor device is a first memory device; and
a package connected to the vias, wherein the third semiconductor device is located between the first semiconductor device and the package.
2. The semiconductor device of claim 1 , wherein the package further comprises a second memory device with a lower bandwidth than the first memory device.
3. The semiconductor device of claim 1 , wherein the third semiconductor device further comprises a plurality of memory die.
4. The semiconductor device of claim 1 , further comprising a fourth semiconductor device connected to the second semiconductor device and located between the second semiconductor device and the package.
5. The semiconductor device of claim 1 , wherein the first semiconductor device comprises a memory controller.
6. A method for packaging semiconductor devices, the method comprising:
forming vias over a carrier wafer;
attaching a first die over the carrier wafer, the first die comprising a plurality of through silicon vias;
attaching a second die over the carrier wafer;
encapsulating the first die, the second die, and the vias to form a first package;
removing the carrier wafer;
connecting a third die to a first side of the first package, wherein the third die is electrically connected to the plurality of through silicon vias; and
connecting a second package to the first side of the first package, wherein the third die is located between the first die and the second die.
7. The method of claim 6 , further comprising connecting a fourth die to the first side of the first package, wherein the fourth die is electrically connected to the second die.
8. The method of claim 6 wherein the connecting the third die further comprises connecting a stack of dies to the first side of the first package.
9. The method of claim 8 , further comprising connecting a fourth die to the first side of the first package, wherein the fourth die is electrically connected to the second die.
10. The method of claim 6 , wherein the third die is a first memory device.
11. The method of claim 10 , wherein the second package comprises a second memory device and wherein the second memory device has a lower bandwidth than the first memory device.
12. The method of claim 10 , wherein the first memory device is a wide I/O memory device.
13. The method of claim 6 , wherein the second die is a digital die and the first die comprises an analog section.
14. A method of manufacturing a semiconductor device, the method comprising:
connecting a first semiconductor device to a first package, the first package comprising:
a second semiconductor device, the second semiconductor device comprising a plurality of through silicon vias, wherein the first semiconductor device is located over the second semiconductor device;
a third semiconductor device, wherein the third semiconductor device is electrically connected to the second semiconductor device and does not have a through silicon via;
an encapsulant encapsulating the second semiconductor device and the third semiconductor device; and
vias extending all of the way through the encapsulant; and
connecting a second package to the vias, wherein the second package is over the first semiconductor device and the second semiconductor device.
15. The method of claim 14 , further comprising forming a redistribution layer in electrical connection with the second semiconductor device, the third semiconductor device, and the vias, wherein the forming the redistribution layer forms the redistribution layer on an opposite side of the second semiconductor device from the first semiconductor device.
16. The method of claim 14 , wherein the first semiconductor device comprises a memory device.
17. The method of claim 16 , wherein the memory device is a wide I/O memory device.
18. The method of claim 14 , wherein the second package comprises a first memory device that has a smaller bandwidth than the first semiconductor device.
19. The method of claim 18 , wherein the first memory device is a flash memory device and the first semiconductor device is a wide I/O device.
20. The device of claim 1 , wherein the first memory device is a wide I/O memory device.