Deposition method and deposition apparatus
Disclosed is a method for depositing an insulating film with a high coverage through a low temperature process. The deposition method deposits an insulating film on a substrate using a deposition apparatus which includes a processing container that defines a processing space in which plasma is generated, a gas supply unit configured to supply a gas into the processing space, and a plasma generating unit configured to generate plasma by supplying microwave into the processing container. The deposition method includes depositing an insulating film that includes SiN on the substrate by supplying into a gas formed by adding H 2 to trisilylamine into the processing container and generating plasma.
1. A method of depositing an insulating film on a substrate, the method comprising:
providing a deposition apparatus including a processing container that defines a processing space in which plasma is generated, a gas supply unit configured to supply gas into the processing space, and a plasma generating unit configured to generate plasma by supplying microwave into the processing container;
depositing an insulating film that includes SiN on the substrate by supplying a mixed gas formed by adding H 2 to trisilylamine into the processing container and generating plasma in the processing space;
after the depositing of the insulating film including SiN, substituting SiH remaining within the insulating film with SiN by supplying a gas including N 2 and generating plasma; and
repeating the depositing and the substituting plural times,
wherein, during the depositing of the insulating film, a pressure within the processing container is controlled to be 400 mTorr or more, and the pressure within the processing container during the depositing of the insulating film is higher than a pressure within the processing container during the substituting of the insulating film, and
a processing time for the substituting of the insulating film ranges from 10 seconds to 20 seconds.
2. The method of claim 1 , wherein the substrate includes a layered structure in which a first magnetic layer and a second magnetic layer are stacked with a tunnel barrier layer interposed therebetween.
3. The method of claim 1 , wherein a processing temperature is controlled to be in a range from 200° C. to 350° C. in the depositing and the substituting of the insulating film.
4. An apparatus of depositing a film on a substrate, the apparatus comprising:
a processing container that defines a processing space in which plasma is generated;
a gas supply unit configured to supply a gas into the processing space;
a plasma generating unit configured to generate the plasma by supplying microwave into the processing container; and
a control unit configured to control the gas supply unit and the plasma generating unit in such a manner that at least a portion of a mixed gas formed by adding H 2 to trisilylamine is supplied into the processing container and plasma is generated so as to deposit an insulating film that includes SiN on the substrate, and after depositing the insulating film, a gas including N 2 is supplied into the processing container and plasma is generated so as to substitute SiH remaining within the insulating film with SiN,
wherein the control unit controls the gas supply unit and the plasma generating unit so as to repeat the deposition of the insulating film and the substitution of the SiH with SiN plural times,
the control unit controls a pressure within the processing container to be 400 mTorr or more during the depositing of the insulating film, and the pressure within the processing container during the depositing of the insulating film is higher than a pressure within the processing container during the substituting of the insulating film, and
the control unit performs the substitution of the insulating film for a time period ranging from 10 seconds to 20 seconds.