Semiconductor package with conductive clip
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
1. A semiconductor package comprising:
a conductive clip;
a dielectric body disposed over at least a portion of said conductive clip;
at least one I/O terminal, said dielectric body electrically insulating said at least one I/O terminal from said conductive clip; and
a power semiconductor device having at least one power electrode electrically connected to said conductive clip.
2. The semiconductor package of claim 1 , wherein said power semiconductor device is a power MOSFET.
3. The semiconductor package of claim 1 , wherein said power semiconductor device is an IGBT.
4. The semiconductor package of claim 1 , wherein said conductive clip is can-shaped.
5. The semiconductor package of claim 1 , wherein said conductive clip comprises copper.
6. The semiconductor package of claim 1 , wherein said conductive clip is plated with either gold or silver.
7. The semiconductor package of claim 1 further comprising a conductive pad.
8. The semiconductor package of claim 7 further comprising a track connecting said conductive pad to said at least one I/O terminal.
9. The semiconductor package of claim 8 further comprising a solder resist body covering at least said track.
10. The semiconductor package of claim 1 , wherein said dielectric body comprises a polymer.