Memory arrays with a memory cell adjacent to a smaller size of a pillar having a greater channel length than a memory cell adjacent to a larger size of the pillar and methods
The disclosure is related to memory arrays and methods. One such memory array has a substantially vertical pillar. A memory cell adjacent to the pillar where the pillar has a first size has a greater channel length than a memory cell adjacent to the pillar where the pillar has a second size larger than the first size.
1. A method of forming a memory array, comprising:
forming a plurality of control gates;
forming a plurality of first dielectrics, wherein the control gates and the first dielectrics alternate so that one of the plurality of first dielectrics is interposed between successively adjacent ones of the plurality of control gates;
forming a plurality of blocking dielectrics so that a blocking dielectric is adjacent to each of the plurality of control gates;
forming a plurality of charge-storage structures so that a charge-storage structure is adjacent to each of the plurality of blocking dielectrics;
forming a plurality of tunnel dielectrics so that a tunnel dielectric is adjacent to each of the plurality of charge-storage structures;
forming a substantially vertical pillar adjacent to the plurality of tunnel dielectrics;
wherein each memory cell of a portion of a series-coupled string of memory cells comprises one of the control gates, one of the blocking dielectrics, one of the charge-storage structures, and one of the tunnel dielectrics;
wherein one of the plurality of first dielectrics is further interposed between successively adjacent ones of the plurality of plurality of blocking dielectrics, between successively adjacent ones of the plurality of charge-storage structures, and between successively adjacent ones of the plurality of tunnel dielectrics; and
wherein a memory cell of the series-coupled string where the pillar has a first size has a greater thickness than a memory cell of the series-coupled string where the pillar has a second size larger than the first size.
2. The method of claim 1 , wherein forming the plurality of charge-storage structures comprises forming a plurality of floating gates.
3. The method of claim 1 , wherein forming the plurality of charge-storage structures comprises forming a plurality of charge traps.
4. The method of claim 1 , further comprising forming a select gate adjacent to a conductive plug before forming the plurality of control gates and the plurality of first dielectrics.
5. The method of claim 4 , wherein forming the plurality of control gates and forming the plurality of first dielectrics comprises forming the plurality of control gates and forming the plurality of first dielectrics over the select gate and the conductive plug.
6. The method of claim 5 , wherein forming the substantially vertical pillar comprises forming the substantially vertical pillar over the conductive plug so that the substantially vertical pillar is physically coupled to the conductive plug.
7. The method of claim 4 , wherein the select gate is a first select gate and the conductive plug is a first conductive plug, and further comprising, after forming the substantially vertical pillar, forming a second select gate adjacent to a second conductive plug that is physically coupled to the substantially vertical pillar so that the substantially vertical pillar is between the first and second conductive plugs.
8. The method of claim 7 , further comprising forming a data line over the second conductive plug so that the second conductive plug is between the data line and the substantially vertical pillar.
9. The method of claim 1 , further comprising, before forming the plurality of blocking dielectrics:
forming an opening through the plurality of control gates and the plurality of first dielectrics to expose edges of the plurality of control gates and the plurality of first dielectrics; and
recessing the exposed edges of respective ones of the plurality of control gates relative to the exposed edges of the plurality of first dielectrics to form respective ones of a plurality of indentations adjacent to the recessed exposed edges of the respective ones of the plurality of control gates;
wherein forming the plurality of blocking dielectrics so that a blocking dielectric is adjacent to each of the plurality of control gates comprises forming respective ones of the plurality of blocking dielectrics in the respective ones of the plurality of indentations adjacent to the recessed exposed edges of the respective ones of the plurality of control gates.
10. The method of claim 9 , wherein forming the plurality of charge-storage structures so that a charge-storage structure is adjacent to each of the plurality of blocking dielectrics comprises forming respective ones of the plurality of charge-storage structures in the respective ones of the plurality of indentations adjacent to the respective ones of the plurality of blocking dielectrics in the respective ones of the plurality of indentations.
11. The method of claim 10 , wherein forming the plurality of tunnel dielectrics so that a tunnel dielectric is adjacent to each of the plurality of charge-storage structures comprises forming respective ones of the plurality of tunnel dielectrics in the respective ones of the plurality of indentations adjacent to the respective ones of the plurality of charge-storage structures in the respective ones of the plurality of indentations.
12. The method of claim 11 , wherein forming the substantially vertical pillar adjacent to the plurality of tunnel dielectrics comprises forming the substantially vertical pillar in the opening adjacent to portions of the plurality of tunnel dielectrics that are exposed by the opening and adjacent to the exposed edges of the plurality of first dielectrics.
13. A method of forming a memory array, comprising:
forming a plurality of control gates;
forming a plurality of dielectrics, wherein the control gates and the dielectrics alternate so that one of the plurality of dielectrics is interposed between successively adjacent ones of the plurality of control gates;
forming a charge storage structure adjacent to the plurality of control gates and the plurality of dielectrics; and
forming a substantially vertical pillar adjacent to the charge storage structure;
wherein each memory cell of a portion of a series-coupled string of memory cells comprises one of the control gates and a portion of the charge storage structure; and
wherein a memory cell of the series-coupled string where the pillar has a first size has a greater thickness than a memory cell of the series-coupled string where the pillar has a second size larger than the first size.
14. A method of forming a memory array, comprising:
forming a plurality of first conductors;
forming a plurality of first dielectrics, wherein the first conductors and the first dielectrics alternate so that one of the plurality of first dielectrics is interposed between successively adjacent ones of the plurality of first conductors;
forming an opening through the plurality of first conductors and the plurality of first dielectrics, wherein a cross-sectional area of the opening decreases with increasing distance from a top of the opening, and wherein at least a portion of the plurality of first conductors have thicknesses that increase with increasing distance from the top of the opening;
recessing edges of the first conductors that are exposed by the opening relative to edges of the first dielectrics that are exposed by the opening to form indentations between adjacent ones of the first dielectrics;
forming a second dielectric in each of the indentations adjacent to the recessed edge of each of the first conductors;
forming a second conductor in each of the indentations adjacent to the second dielectric;
forming a third dielectric in each of the indentations adjacent to the second conductor; and
forming a semiconductor in the opening adjacent to the first and third dielectrics.
15. The method of claim 14 , wherein another portion of the plurality of first conductors that are above the at least the portion of the plurality of first conductors that have thicknesses that increase with increasing distance from the top of the opening have thicknesses that are substantially the same as each other.
16. The method of claim 14 , wherein forming the second conductor in each of the indentations adjacent to the second dielectric comprises forming the second conductor between prongs of the second dielectric in each of the indentations.
17. The method of claim 16 , wherein forming the third dielectric in each of the indentations adjacent to the second conductor comprises forming the third dielectric between the prongs of the second dielectric in each of the indentations.
18. The method of claim 14 , wherein the semiconductor is a first semiconductor and the opening is a first opening, and further comprising, before forming the plurality of first conductors and the plurality of first dielectrics:
forming a third conductor over a fourth dielectric over a second semiconductor;
forming a fifth dielectric over the third conductor;
forming a second opening through the fifth dielectric, the third conductor, and the fourth dielectric to expose an edge of the third conductor;
forming a sixth dielectric in the second opening on the exposed edge of the third conductor; and
forming a fourth conductor in the second opening adjacent to the fourth, fifth, and sixth dielectrics.
19. The method of claim 18 , wherein forming the plurality of first conductors and the plurality of first dielectrics comprises forming the plurality of first conductors and the plurality of first dielectrics over the fourth conductor and fifth dielectric.
20. The method of claim 19 , wherein forming the first opening through the plurality of first conductors and the plurality of first dielectrics exposes the fourth conductor.
21. The method of claim 20 , wherein forming the first semiconductor in the opening adjacent to the first and third dielectrics comprises forming the first semiconductor in contact with the exposed fourth conductor.
22. The method of claim 14 , wherein the opening is a first opening, and further comprising:
forming a third conductor over the semiconductor;
forming a fourth dielectric over the third conductor;
forming a second opening through the fourth dielectric and third conductor to expose an edge of the third conductor and to expose the semiconductor;
forming a fifth dielectric in the second opening on the exposed edge of the third conductor; and
forming a fourth conductor in the second opening adjacent to the fourth and fifth dielectrics and in contact with the exposed semiconductor.
23. The method of claim 22 , further comprising forming a fifth conductor over the fourth conductor.