Method and device for transferring a chip to a contact substrate
A method and device for transferring a chip ( 18 ) situated on a transfer substrate ( 26 ) to a contact substrate ( 50 ), and for contacting the chip with the contact substrate, in which the chip, the back side ( 19 ) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts ( 59, 60 ) thereof that are arranged opposite a contact surface ( 58 ) of the contact substrate are brought into contact with substrate contacts ( 56, 57 ) arranged on the contact surface by means of a pressing device ( 45, 46 ) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.
1. A method for transferring a chip situated on a transfer foil to a contact substrate, and for establishing contact between the chip and the contact substrate, in which the chip, the back side of which is attached adhesively to a support surface of the transfer foil facing the contact substrate, is charged with laser energy from behind through the transfer foil, and the chip contacts thereof that are arranged opposite a contact surface of the contact substrate are brought into contact with substrate contacts arranged on the contact surface by means of a pressing device from behind through the transfer foil thereby the pressing device deflecting the transfer foil, the contacting of the chip contacts with the substrate contacts being carried out by deflecting the transfer foil, and a thermal bond is created between the chip contacts and the substrate contacts while the foil being in the deflected state.
2. The method according to claim 1 , in which in order to secure the chip adhesively on the transfer substrate, the foil is provided with an adhesive application at least in the contact area with the back side of the chip.
3. The method according to claim 2 , in which the foil is provided with an adhesive application film.
4. The method according to claim 1 , in which an adhesive application arranged between the chip and the contact substrate is used to bond the chip to the contact substrate.
5. The method according to claim 1 , in which a solder material application disposed on the chip contacts and/or the substrate contacts is used to bond the chip to the contact substrate.
6. The method according to claim 1 , in which a plurality of chips arranged on a common foil is transferred to the contact substrate and contacted therewith at the same time.
7. The method according to claim 6 , in which the chips are arranged on the foil in a wafer arrangement created by separating the chips from a wafer composite.
8. The method according to claim 7 , in which the foil on which a wafer is arranged during separation of the chips from the wafer composite is used as the foil.
9. The method according to claim 6 , in which the chips are arranged on the foil in a transfer arrangement that matches a contact substrate arrangement of the chips on the contact substrate.
10. A method for transferring a chip situated on a transfer foil to a contact substrate, and for establishing contact between the chip and the contact substrate, in which a the back side of the chip is attached adhesively to a support surface of the transfer foil facing the contact substrate, said method comprising:
charging the chip having chip contacts with laser energy from behind through the transfer foil;
arranging the chip contacts opposite a contact surface of the contact substrate;
bringing the chip contacts into contact with substrate contacts arranged on the contact surface by means of a pressing device deflecting the transfer foil from behind the transfer foil; and
thermally bonding the chip contacts and the substrate contacts while the foil is deflected by the pressing device.