Method of manufacturing semiconductor device, substrate processing apparatus, gas supply system, and recording medium
A method of manufacturing a semiconductor device includes alternately performing supplying a first process gas containing silicon and a halogen element to a substrate having a surface on which monocrystalline silicon and an insulation film are exposed and supplying a second process gas containing silicon and not containing a halogen element to the substrate, and supplying a third process gas containing silicon to the substrate, whereby a first silicon film is homo-epitaxially grown on the monocrystalline silicon and a second silicon film differing in crystal structure from the first silicon film is grown on the insulation film.
1. A method of manufacturing a semiconductor device, comprising:
alternately performing supplying a first process gas containing silicon and a halogen element to a substrate having a surface on which monocrystalline silicon and an insulation film are exposed and supplying a second process gas containing silicon and not containing a halogen element to the substrate; and
supplying a third process gas containing silicon to the substrate,
whereby a first silicon film is homo-epitaxially grown on the monocrystalline silicon and a second silicon film differing in crystal structure from the first silicon film is grown on the insulation film.
2. The method of claim 1 , wherein in the act of alternately performing the act of supplying the first process gas and the act of supplying the second process gas, the first silicon film is homo-epitaxially grown on the monocrystalline silicon and a seed layer is formed on the insulation film, and
in the act of supplying the third process gas, the first silicon film is further homo-epitaxially grown and the second silicon film is grown on the seed layer.
3. The method of claim 1 , wherein a recess is formed on the surface of the substrate, the recess including a bottom portion formed of the monocrystalline silicon and a side portion formed of the insulation film.
4. The method of claim 3 , wherein a top portion of the first silicon film is covered with the second silicon film grown from the side portion of the recess, so as to stop homo-epitaxial growth of the first silicon film.
5. The method of claim 3 , wherein a top portion of the first silicon film is covered with the second silicon film grown from the side portion of the recess, so as to form a laminated structure including the first silicon film and the second silicon film laminated on the first silicon film.
6. The method of claim 1 , wherein a crystal structure of the second silicon film is an amorphous, a polycrystal or a mixture of the amorphous and the polycrystal.
7. The method of claim 1 , wherein the first process gas includes silane chloride, the second process gas includes hydrogenated silane, and the third process gas includes hydrogenated silane.
8. The method of claim 1 , wherein in the act of supplying the third process gas, a dopant gas together with the third process gas is supplied to the substrate.
9. The method of claim 1 , wherein the second process gas differs in molecular structure from the third process gas.
10. The method of claim 1 , wherein a pyrolysis temperature of the second process gas is lower than a pyrolysis temperature of the third process gas.
11. The method of claim 1 , wherein the second process gas is identical in molecular structure with the third process gas.
12. The method of claim 1 , further comprising thermally treating the first silicon film and the second silicon film.
13. The method of claim 12 , wherein in the act of thermally treating the first silicon film and the second silicon film, a portion of the second silicon film which makes contact with the first silicon film is changed into a homo-epitaxial state.
14. The method of claim 12 , wherein in the act of thermally treating the first silicon film and the second silicon film, a portion of the second silicon film which makes contact with the first silicon film is changed into a homo-epitaxial silicon film.
15. The method of claim 12 , wherein in the act of thermally treating the first silicon film and the second silicon film, a region occupied by the first silicon film is expanded.
16. The method of claim 1 , wherein in the act of alternately performing the act of supplying the first process gas and the act of supplying the second process gas, a temperature of the substrate is set at a first temperature, and
in the act of supplying the third process gas, a temperature of the substrate is set at a second temperature equal to or higher than the first temperature.
17. The method of claim 16 , further comprising thermally treating the first silicon film and the second silicon film,
wherein in the act of thermally treating the first silicon film and the second silicon film, a temperature of the substrate is set at a third temperature equal to or higher than the second temperature.
18. The method of claim 1 , wherein the semiconductor device includes a three-dimensional flash memory or a dynamic random access memory.
19. A non-transitory computer-readable recording medium storing a program that causes a computer to perform processes of alternately performing supplying a first process gas containing silicon and a halogen element to a substrate having a surface on which monocrystalline silicon and an insulation film are exposed and supplying a second process gas containing silicon and not containing a halogen element to the substrate; and
supplying a third process gas containing silicon to the substrate,
whereby a first silicon film is homo-epitaxially grown on the monocrystalline silicon and a second silicon film differing in crystal structure from the first silicon film is grown on the insulation film.