Semiconductor device and method of fabricating the same
A semiconductor device and a method for manufacturing the same are capable of improving GIDL in a buried gate, and preventing degradation of device characteristics and reliability due to reduction in gate resistance. The semiconductor device may include: junction regions formed at both sidewalls of a trench formed in a semiconductor substrate; a first gate electrode formed in a lower portion of the trench; a second gate electrode formed on at least one inner sidewall of the trench which overlaps one of the junction regions on the first gate electrode; and a third gate electrode formed on one side of the second gate electrode on the first gate electrode.
1. A method of fabricating a semiconductor device, the method comprising:
etching a gate region of a semiconductor substrate to form a trench;
forming a first gate material layer filling the trench;
etching the first gate material layer, to form a first gate electrode, to a depth at which the first gate electrode does not overlap with junction regions of the semiconductor substrate;
forming a second gate electrode over at least one inner sidewall of the trench and over the first gate electrode; and
forming a third gate electrode in the trench over one side of the second gate electrode and over the first gate electrode,
wherein the second gate electrode is electrically coupled to the first gate electrode.
2. The method of claim 1 , wherein the at least one inner sidewall of the trench includes first and second inner sidewalls, and
wherein the forming the second gate electrode includes forming the second gate electrode over the first and second inner sidewalls of the trench adjacent to the junction regions and over the first gate electrode.
3. The method of claim 1 , wherein the forming the second gate electrode includes forming the second gate electrode over the one inner sidewall of the trench adjacent to a storage node contact.
4. The method of claim 1 , wherein the forming the second gate electrode includes forming the second gate electrode to have a height to overlap the junction regions.
5. The method of claim 1 , wherein the etching the first gate material layer includes:
etching the first gate material layer such that an upper surface of the first gate electrode does not overlap with the junction regions.
6. The method of claim 1 , the method further comprising:
forming a barrier layer over the one side of the second gate electrode before the forming the third gate electrode.
7. The method of claim 6 , wherein the barrier layer is formed using at least one of titanium (Ti) and titanium nitride (TiN).
8. The method of claim 1 , the method further comprising:
forming a gate insulating layer along a contour of the trench before forming the first gate material layer.
9. The method of claim 8 , wherein the forming the first gate material layer includes:
forming a barrier metal layer over the gate insulating layer in the trench; and
depositing a first gate material over the barrier metal layer to form the first gate material layer.
10. The method of claim 9 , wherein the etching the first gate material layer includes:
partially etching the first gate material layer and simultaneously partially etching the barrier metal layer.
11. The method of claim 1 , wherein the first gate electrode and the third gate electrode are formed of a metal material and the second gate electrode is formed of a polysilicon material.
12. The method of claim 1 , wherein the at least one inner sidewall of the trench includes first and second inner sidewalls, and
wherein the forming the second gate electrode includes:
depositing a second gate material along a contour of the trench;
performing spacer-etching on the second gate material to remain over the first and second inner sidewalls of the trench; and
etching the second gate material remaining over the both sidewalls of the trench to a fixed height, to form the second gate electrode.
13. The method of claim 1 , wherein the at least one inner sidewall of the trench includes first and second inner sidewalls, and
wherein the forming the second gate electrode includes:
depositing a second gate material along a contour of the trench;
etching the second gate material through spacer-etching to remain over the first and second inner sidewalls of the trench;
etching remaining second gate material over the both sidewalls of the trench to a fixed height;
forming a photoresist layer covering the second gate material at a storage node contact side; and
removing the second gate material formed over another sidewall of the trench and exposed by the photoresist layer.
14. The method of claim 1 , wherein the first gate electrode is electrically coupled to the third gate electrode.