IP Library Granted Patent US 9,437,521
Granted Patent B2
US 9,437,521 · App. 14/989,686 · Granted Sep 6, 2016

Thermally conductive sheet

Inventors: Keisuke Aramaki (Tokyo, JP); Takuhiro Ishii (Tokyo, JP); Masahiko Ito (Tokyo, JP); Shinichi Uchida (Tokyo, JP); Atsuya Yoshinari (Tokyo, JP); Syunsuke Uchida (Tokyo, JP)
Assignee: DEXERIALS CORPORATION
H01L23/3737B29C47/0066H01L23/3675H01L23/3733B29L2031/18
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Quick Facts
Patent No.
US 9,437,521
App. No.
14/989,686
Granted
Sep 6, 2016
Kind
B2
Abstract

A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Claims (47)

1. A thermally conductive sheet comprising:

a curable resin composition;

thermally conductive fibers; and

thermally conductive particles,

wherein the thermally conductive sheet has a thickness of more than 1.5 mm and 3.0 mm or less,

wherein the thermally conductive sheet has a compressibility of 40% or more, and has a minimum value of a thermal resistance in a load range of 0.5 kgf/cm 2 or more and 3 kgf/cm 2 or less, and

wherein the thermally conductive sheet has a peak value of a thermal conductivity of 15 W/mK or more in the compressibility thereof of 20% or less.

2. The thermally conductive sheet according to claim 1 , wherein

the thermally conductive sheet has a maximum compression stress of less than 780 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less.

3. The thermally conductive sheet according to claim 1 , wherein

the thermally conductive sheet has a residual stress of less than 204 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less and is held for 10 min in a state of being compressed by 40%.

4. The thermally conductive sheet according to claim 1 , wherein

the curable resin composition is a two-part addition reaction type liquid silicone resin of a silicone base resin and a curing agent; and the silicone base resin and the curing agent are blended at a ratio (silicone base resin:curing agent) of 5:5 to 6:4.

5. The thermally conductive sheet according to claim 1 , wherein

the thermally conductive fibers have an average fiber length of 50 μm or more and 250 μm or less.

6. The thermally conductive sheet according to claim 1 , wherein the thermally conductive sheet has a peak value of a thermal conductivity of 20 W/mK or more in the compressibility thereof of 20% or less.

7. The thermally conductive sheet according to claim 1 , wherein

the thermally conductive sheet has a content of the thermally conductive particles and the thermally conductive fibers of 70% by volume or less.

8. The thermally conductive sheet according to claim 1 , wherein

the thermally conductive sheet is made by cutting a columnar cured product obtained by extruding a thermally conductive composition comprising the curable resin composition, the thermally conductive fibers and the thermally conductive particles, in a substantially perpendicular direction to a longitudinal direction of the columnar cured product.

9. A device comprising:

a heat source;

a heat-dissipating member; and

the thermally conductive sheet according to claim 1 interposed between the heat source and the heat-dissipating member.

10. The device according to claim 9 , wherein

the thermally conductive sheet has a thermal resistance of less by 3% or more than an initial value of the thermal resistance of the thermally conductive sheet interposed between the heat source and the heat-dissipating member.

11. A method for producing a thermally conductive sheet, the method comprising:

extruding a thermally conductive composition comprising a curable resin composition, thermally conductive fibers and thermally conductive particles; and

cutting an extruded columnar cured product in a substantially perpendicular direction to a longitudinal direction of the extruded columnar cured product to thereby obtain the thermally conductive sheet,

wherein in the cutting, the extruded columnar cured product is cut to have a predetermined thickness of more than 1.5 mm and 3.0 mm or less so that the thermally conductive sheet exhibits a maximum compression stress of less than 780 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less, and the thermally conductive sheet has a peak value of a thermal conductivity of 15 W/mK or more in a compressibility thereof of 20% or less.

12. The method for producing a thermally conductive sheet according to claim 11 , wherein

in the cutting, the extruded columnar cured product is cut to have the predetermined thickness so that the thermally conductive sheet exhibits a residual stress of less than 204 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less and held for 10 min in a state of being compressed by 40%.

13. The method for producing a thermally conductive sheet according to claim 11 , wherein

in the cutting, the extruded columnar cured product is cut to have the predetermined thickness so that the thermally conductive sheet exhibits a thermal resistance of 2.0 K·cm 2 /W or less in a load range of 0.5 kgf/cm 2 or more and 7.5 kgf/cm 2 or less.

14. The method for producing a thermally conductive sheet according to claim 11 , further comprising pressing the thermally conductive sheet cut in the substantially perpendicular direction, wherein

the pressing is carried out so that the thermally conductive sheet has a thermal resistance of 2.0 K·cm 2 /W or less in a load range of 0.5 kgf/cm 2 or more and 7.5 kgf/cm 2 or less.

15. The method for producing a thermally conductive sheet according to claim 14 , wherein

the pressing is carried out at a pressure of 0.1 MPa or more and 30 MPa or less.

16. The method for producing a thermally conductive sheet according to claim 14 , wherein

the pressing is carried out at a temperature of room temperature or more and 140° C. or less.

17. A thermally conductive sheet which is obtained by the method for producing a thermally conductive sheet according to claim 11 .

18. A device comprising:

a heat source;

a heat-dissipating member; and

the thermally conductive sheet according to claim 17 interposed between the heat source and the heat-dissipating member.

19. The device according to claim 18 , wherein

the thermally conductive sheet has a thermal resistance of less by 3% or more than an initial value of the thermal resistance of the thermally conductive sheet interposed between the heat source and the heat-dissipating member.

Assignments (3)
NUNC PRO TUNC ASSIGNMENT Recorded Aug 12, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 071999/0883 →
CHANGE OF ADDRESS Recorded Jun 30, 2025
From: DEXERIALS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 071756/0646 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: ARAMAKI, KEISUKE; ISHII, TAKUHIRO; ITO, MASAHIKO; UCHIDA, SHINICHI; YOSHINARI, ATSUYA; UCHIDA, SYUNSUKE
To: DEXERIALS CORPORATION
Reel/Frame 037711/0501 →
Priority Claims (2)
JP 2013-145035 · Jul 10, 2013 · national
JP 2014-086432 · Apr 18, 2014 · national
Continuity (2)
Continuation PCTJP2014068258 · Jul 9, 2014
Related Publication 20160118316A1 · Apr 28, 2016