Manufacturing method of cover structure

1. A method of manufacturing a cover structure, the method comprising:

providing a first insulating layer having a first surface and a second surface opposite to each other;

providing a second insulating layer having a third surface and a fourth surface opposite to each other and an opening passing through the third surface and the fourth surface, wherein a thickness of the second insulating layer is greater than a thickness of the first insulating layer;

laminating the first insulating layer and the second insulating layer for the third surface of the second insulating layer to connect to the second surface of the first insulating layer, wherein a cavity is defined by the opening of the second insulating layer and the first insulating layer;

forming a metal layer on the cavity and on the fourth surface of the second insulating layer; and

patterning a portion of the metal layer formed on the fourth surface of the second insulating layer to form a patterned circuit layer.

2. The method of manufacturing the cover structure as claimed in claim 1 , wherein the second insulating layer is an adhesive film.

3. The method of manufacturing the cover structure as claimed in claim 1 , further comprising:

forming an adhesive layer between the first insulating layer and the second insulating layer before laminating the first insulating layer and the second insulating layer; and

laminating the first insulating layer and the second insulating layer to join the first insulating layer and the second insulating layer through the adhesive layer.

4. The method of manufacturing the cover structure as claimed in claim 1 , further comprising:

forming a copper foil layer on the fourth surface of the second insulating layer after forming the second insulating layer;

forming an adhesive layer between the first insulating layer and the second insulating layer before laminating the first insulating layer and the second insulating layer;

laminating the first insulating layer and the second insulating layer to join the first insulating layer and the second insulating layer through the adhesive layer;

connecting the metal layer to the copper foil layer after forming the metal layer on the cavity; and

patterning the copper foil layer to form a patterned circuit layer.

5. The method of manufacturing the cover structure as claimed in claim 1 , further comprising:

forming a first copper foil layer and a second copper foil layer on the first surface and the second surface of the first insulating layer respectively after forming the first insulating layer;

forming a third copper foil layer and a fourth copper foil layer on the third surface and the fourth surface of the second insulating layer respectively after forming the second insulating layer;

forming an adhesive layer between the second copper foil layer and the third copper foil layer before laminating the first insulating layer and the second insulating layer;

laminating the first insulating layer and the second insulating layer to join the second copper foil layer and the third copper foil layer through the adhesive layer;

connecting the metal layer to the fourth copper foil layer after forming the metal layer on the cavity; and

patterning the first copper foil layer and the fourth copper foil layer to form a first patterned circuit layer and a fourth patterned circuit layer.

6. The method of manufacturing the cover structure as claimed in claim 5 , further comprising:

patterning the second copper foil layer and the third copper foil layer before forming the adhesive layer to form a second patterned circuit layer and a third patterned circuit layer;

forming the adhesive layer between the second patterned circuit layer and the third patterned circuit layer; and

laminating the first insulating layer and the second insulating layer to join the second patterned circuit layer and the third patterned circuit layer through the adhesive layer.

7. The method of manufacturing the cover structure as claimed in claim 6 , further comprising:

forming at least one via passing through the first copper foil layer, the first insulating layer, the second patterned circuit layer, the adhesive layer, the third patterned circuit layer, the second insulating layer, and the fourth copper foil layer after laminating the first insulating layer and the second insulating layer;

forming the metal layer on an inner wall of the via while forming the metal layer on the cavity; and

filling a conductive material in the via before patterning the first copper foil layer and the fourth copper foil layer.