IP Library Granted Patent US 9,498,935
Granted Patent B2
US 9,498,935 · App. 14/196,593 · Granted Nov 22, 2016

Molding packaging material and molded case

Inventors: Yuuji Minamibori (Isehara, JP); Tetsunobu Kuramoto (Isehara, JP)
Assignee: SHOWA DENKO PACKAGING CO.
B32B15/088B32B7/12B32B15/085H01M2/026H01M2/0257H01M2/0262H01M2/0277H01M2/0285H01M2/0287B32B2250/03B32B2323/10Y10T428/1359Y10T428/24942Y10T428/31562Y10T428/31678Y10T428/31681
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Quick Facts
Patent No.
US 9,498,935
App. No.
14/196,593
Granted
Nov 22, 2016
Kind
B2
Abstract

A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3 , in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2 . The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.

Claims (41)

1. A molding packaging material, comprising:

a biaxially stretched polyamide film layer as an outer layer;

a thermoplastic resin layer as an inner layer; and

a metal foil layer disposed between the both layers, wherein

as the biaxially stretched polyamide film, a biaxially stretched polyamide film in which when a fracture strength of the film is defined as “X” and a fracture strain of the film is defined as “Y”, a X/Y value is 230 MPa to 360 MPa is used,

when a coefficient of static friction between outer surfaces of the biaxially stretched polyamide film layer is defined as “A” and a coefficient of dynamic friction between the outer surfaces of the biaxially stretched polyamide film layer is defined as “B”, a A/B value is in the range of 1.0 to 2.0, and

when a coefficient of static friction between outer surfaces of the thermoplastic resin layer is defined as “C” and a coefficient of dynamic friction between the outer surfaces of the thermoplastic resin layer is defined as “D”, a C/D value is in the range of 1.0 to 2.0.

2. The molding packaging material according to claim 1 , wherein

the fracture strain of the biaxially stretched polyamide film is 0.5 or more.

3. The molding packaging material according to claim 1 , wherein

the metal foil layer is one in which a chemical conversion coating is formed on both surfaces of the metal foil.

4. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer is laminated on one surface of the metal foil layer through a urethane adhesive layer and the thermoplastic resin layer is laminated on the other surface of the metal foil layer through a urethane adhesive layer,

the metal foil layer is an aluminum foil layer and the thermoplastic resin layer is a non-stretched polypropylene film layer, and

the biaxially stretched polyamide film is a simultaneously biaxially stretched 6-nylon film.

5. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer is laminated on one surface of the metal foil layer through a urethane adhesive layer and the thermoplastic resin layer is laminated on the other surface of the metal foil layer through a urethane adhesive layer,

the metal foil layer is an aluminum foil layer and the thermoplastic resin layer is a non-stretched polypropylene film layer, and

the biaxially stretched polyamide film is a simultaneously biaxially stretched 6,6-nylon film.

6. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer is laminated on one surface of the metal foil layer through a urethane adhesive layer and the thermoplastic resin layer is laminated on the other surface of the metal foil layer through a urethane adhesive layer,

the metal foil layer is an aluminum foil layer and the thermoplastic resin layer is a non-stretched polypropylene film layer, and

the biaxially stretched polyamide film is a simultaneously biaxially stretched MXD nylon film.

7. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer is laminated on one surface of the metal foil layer through a urethane adhesive layer and the thermoplastic resin layer is laminated on the other surface of the metal foil layer through a urethane adhesive layer,

the metal foil layer is an aluminum foil layer and the thermoplastic resin layer is a non-stretched polypropylene film layer, and

the biaxially stretched polyamide film is a successively biaxially stretched 6-nylon film.

8. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer is laminated on one surface of the metal foil layer through a urethane adhesive layer and the thermoplastic resin layer is laminated on the other surface of the metal foil layer through a urethane adhesive layer,

the metal foil layer is an aluminum foil layer and the thermoplastic resin layer is a non-stretched polypropylene film layer, and

the biaxially stretched polyamide film is a successively biaxially stretched 6,6-nylon film.

9. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer is laminated on one surface of the metal foil layer through a urethane adhesive layer and the thermoplastic resin layer is laminated on the other surface of the metal foil layer through a urethane adhesive layer,

the metal foil layer is an aluminum foil layer and the thermoplastic resin layer is a non-stretched polypropylene film layer, and

the biaxially stretched polyamide film is a successively biaxially stretched MXD-nylon film.

10. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer contains silica particles.

11. The molding packaging material according to claim 1 , wherein

the biaxially stretched polyamide film layer contains fatty acid amide.

12. A molded case, which is obtained by subjecting the molding packaging material according to claim 1 to deep draw forming or bulging.

13. The molded case according to claim 12 , which is used as a battery case.

Assignments (2)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2014
From: MINAMIBORI, YUUJI; KURAMOTO, TETSUNOBU
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032837/0032 →
Priority Claims (1)
JP 2013-042686 · Mar 5, 2013 · national
Continuity (1)
Related Publication 20140255764A1 · Sep 11, 2014