Method for forming barrier layer for dielectric layers in semiconductor devices
A semiconductor device having a high-k gate dielectric, and a method of manufacture, is provided. A gate dielectric layer is formed over a substrate. An interfacial layer may be interposed between the gate dielectric layer and the substrate. A barrier layer, such as a TiN layer, having a higher concentration of nitrogen along an interface between the barrier layer and the gate dielectric layer is formed. The barrier layer may be formed by depositing, for example, a TiN layer and performing a nitridation process on the TiN layer to increase the concentration of nitrogen along an interface between the barrier layer and the gate dielectric layer. A gate electrode is formed over the barrier layer.
1. A method of forming a semiconductor device, the method comprising:
forming an interfacial layer;
forming a dielectric layer over the interfacial layer;
forming a conductive layer over the dielectric layer;
treating, after the forming the conductive layer, the conductive layer to increase an oxygen-blocking ability of the conductive layer, the treated conductive layer comprising a metal nitride containing a higher nitrogen concentration at a top surface located farthest from the dielectric layer than at a location away from the top surface;
forming a silicon cap over the treated conductive layer;
treating the silicon cap with post-capping anneal (PCA) processes;
forming a gate electrode over the silicon cap; and
forming contacts over the gate electrode.
2. The method of claim 1 , wherein the treating is a nitridation process.
3. The method of claim 1 , wherein the treating comprises performing a plasma process using a nitrogen-containing process gas.
4. The method of claim 1 , wherein the treating comprises increasing a nitrogen concentration of the conductive layer along the top surface.
5. The method of claim 1 , wherein the dielectric layer is a high-k dielectric layer.
6. The method of claim 1 , wherein the forming the interfacial layer comprises forming an oxide layer using a chemical oxidation process.
7. The method of claim 1 , wherein the forming the conductive layer comprises forming a TiN layer.
8. The method of claim 7 , wherein the treating comprises forming a TixNy layer along the top surface, a ratio of y:x being from about 1.0 to about 1.2.
9. A method of forming a semiconductor device, the method comprising:
providing a substrate;
forming a gate dielectric layer over the substrate;
forming a barrier layer over the gate dielectric layer;
increasing a first nitrogen concentration in a top surface of the barrier layer to be greater than a second nitrogen concentration in the barrier layer at a location away from the top surface, the top surface being farthest from the gate dielectric layer;
forming a silicon layer over a surface of the barrier layer;
annealing the silicon layer;
forming a gate electrode over the silicon layer;
forming an inter-layer dielectric over the gate electrode;
patterning the inter-layer dielectric to expose a portion of the gate electrode; and
forming a contact over the gate electrode.
10. The method of claim 9 , further comprising forming an interfacial layer prior to forming the gate dielectric layer.
11. The method of claim 10 , wherein the forming the interfacial layer comprises forming a chemical oxide layer.
12. The method of claim 9 , wherein the increasing is performed at least in part by performing a decoupled plasma nitridation (DPN) process.
13. The method of claim 12 , wherein the increasing further comprises annealing after the performing the DPN process.
14. The method of claim 9 , wherein the forming the gate electrode comprises forming a metal gate electrode.
15. The method of claim 9 , wherein the forming the barrier layer comprises forming a TixNy layer, wherein the first nitrogen concentration is ratio of y:x after the increasing the first nitrogen concentration is from about 1.0 to about 1.2.
16. The method of claim 9 , wherein the forming the gate dielectric layer comprises forming a high-k dielectric layer.
17. The method of claim 9 , further comprising, prior to the forming the gate dielectric layer:
forming a dummy gate stack;
forming a dielectric layer, an upper surface of the dielectric layer and an upper surface of the dummy gate stack being coplanar; and
removing the dummy gate stack.
18. A method of forming a semiconductor device, the method comprising:
providing a substrate;
forming a gate dielectric layer over the substrate;
forming a conductive layer over the gate dielectric layer;
performing a nitridation process on the conductive layer, wherein after performing the nitridation process, the conductive layer comprises a first Ti x N y layer along a top surface of the conductive layer, a ratio of y:x being from about 1.0 to about 1.2 at the first Ti x N y layer, and the conductive layer comprising a second Ti x N y layer at a location away from the top surface of the conductive layer, a ratio of y:x of about 0.85 to about 0.98 at the second Ti x N y layer;
forming a silicon layer over the conductive layer;
treating the silicon layer with post-capping anneal (PCA) processes;
forming a gate electrode over the conductive layer;
forming an inter-layer dielectric over the gate electrode, the inter-layer dielectric having an opening above a portion of the gate electrode; and
forming a contact in the opening above the portion of the gate electrode.
19. The method of claim 18 , wherein performing the nitridation process comprises performing a DPN process.
20. The method of claim 18 , wherein the forming the gate dielectric layer comprises forming a high-k dielectric layer.