Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=|( A−B )/ A |×100 (Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.
1. An electronic device, comprising:
an anisotropic conductive adhesive film as a connection material, wherein:
the anisotropic conductive adhesive film is formed from a composition that includes:
about 10 to about 40% by weight of an ethylene-vinyl acetate copolymer,
about 5 to about 40% by weight of a total amount of at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin,
about 5 to about 30% by weight of an isocyanurate acrylate,
about 5 to about 30% by weight of a dicyclopentadiene (meth)acrylate, and
about 5 to about 40% by weight of a film-forming resin, based on the total solid weight of the anisotropic conductive adhesive composition, and
the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1:
Connection resistance increment (%)=|( A−B )/ A|× 100 (Expression 1)
where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.
2. The electronic device as claimed in claim 1 , wherein a solid weight ratio of the ethylene-vinyl acetate copolymer to a total amount of the at least one resin selected from the group of the acrylate modified urethane resin and the ester type urethane resin is from about 1:3 to about 3:1.
3. The electronic device as claimed in claim 1 , wherein:
the isocyanurate acrylate includes an isocyanuric acid ethylene oxide-modified triacrylate, and
the dicyclopentadiene (meth)acrylate includes a tricyclodecanedimethanol diacrylate.
4. The electronic device as claimed in claim 1 , wherein the anisotropic conductive adhesive composition further includes about 1 to about 10% by weight of an organic peroxide and about 1 to about 10% by weight of conductive particles.
5. The electronic device as claimed in claim 1 , wherein:
the at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin includes the acrylate modified urethane resin, and
the acrylate modified urethane resin is formed from a diisocyanate, a polyol, and an acrylate.
6. An electronic device, comprising:
an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film is formed from a composition that includes:
about 10 to about 40% by weight of an ethylene-vinyl acetate copolymer,
about 5 to about 40% by weight of a total amount of at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin,
about 5 to about 30% by weight of an isocyanurate acrylate, and
about 5 to about 30% by weight of a dicyclopentadiene (meth)acrylate, and
about 5 to about 40% by weight of a film-forming resin, based on the total solid weight of the anisotropic conductive adhesive composition.
7. The electronic device as claimed in claim 6 , wherein the anisotropic conductive adhesive composition further includes about 1 to about 10% by weight of an organic peroxide and about 1 to about 10% by weight of conductive particles.
8. The electronic device as claimed in claim 6 , wherein a solid weight ratio of the ethylene-vinyl acetate copolymer to a total amount of the at least one resin selected from the group of the acrylate modified urethane resin and the ester type urethane resin is from about 1:3 to about 3:1.
9. The electronic device as claimed in claim 6 , wherein:
the at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin includes the acrylate modified urethane resin, and
the acrylate modified urethane resin is formed from a diisocyanate, a polyol, and an acrylate.
10. The electronic device as claimed in claim 9 , wherein the diisocyanate that forms the acrylate modified urethane resin is selected from the group of tetramethylene-1,4-diisocyanate, hexamethylene-1,6-diisocyanate, cyclohexylene-1,4-diisocyanate, methylenebis(4-cyclohexyl diisocyanate), isophorone diisocyanate, 4,4′-methylenebis(cyclohexyl diisocyanate), and mixtures thereof.
11. The electronic device as claimed in claim 9 , wherein the polyol that forms the acrylate modified urethane resin is a polyester polyol, a polycarbonate polyol, or a diol, the diol being selected from the group of 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tetraethylene glycol, dibutylene glycol, 2-methyl-1,3-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, and 1,4-cyclohexanedimethanol.
12. The electronic device as claimed in claim 9 , wherein the acrylate that forms the acrylate modified urethane resin is a hydroxyacrylate or an amine acrylate.
13. The electronic device as claimed in claim 6 , wherein:
the at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin includes the acrylate modified urethane resin, and
the acrylate modified urethane resin is a reaction product of a polyester polyol and a diisocyanate.
14. The electronic device as claimed in claim 13 , wherein:
the polyester polyol that forms the acrylate modified urethane resin is a reaction product of a dicarboxylic acid and a diol,
the dicarboxylic acid is at least one of phthalic acid, terephthalic acid, isophthalic acid, adipic acid, sebacic acid, succinic acid, glutaric acid, suberic acid, azelaic acid, sebasic acid, dodecanedicarboxylic acid, hexahydrophthalic acid, ortho-phthalic acid, tetrachlorophthalic acid, 1,5-naphthalenedicarboxylic acid, fumaric acid, maleic acid, itaconic acid, citraconic acid, methaconic acid or tetrahydrophthalic acid, and
the diol is at least one of ethylene glycol, propylene glycol, hexanediol, neopentyl glycol, diethylene glycol, triethylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, dipropylene glycol, dibutylene glycol, 2-methyl-1,3-pentanediol, 2,2,4-trimethyl-1,3-pentanediol or 1,4-cyclohexanedimethanol.
15. The electronic device as claimed in claim 13 , wherein the diisocyanate that forms the acrylate modified urethane resin is selected from the group of isophorone diisocyanate (IPDI), tetramethylene-1,4-diisocyanate, hexamethylene-1,6-diisocyanate, diphenylmethane diisocyanate, cyclohexylene-1,4-diisocyanate, methylenebis(4-cyclohexyl isocyanate), xylene diisocyanate, hydrogenated diphenylmethane diisocyanate, naphthalene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, and mixtures thereof.
16. The electronic device as claimed in claim 6 , wherein the film-forming resin is selected from the group of olefin resins, including polyethylene and polypropylene, butadiene resins, acrylonitrile-butadiene copolymers, carboxyl-terminated acrylonitrile-butadiene copolymers, polyimide resins, polyamide resins, polyester resins, polyvinyl butyral resins, styrene-butylene-styrene (SBS) resins, styrene-ethylene-butylene-styrene (SEBS) resins, acrylonitrile-butadiene rubbers (NBRs), styrene acrylonitrile resins, urethane resins, (meth)acrylic resins and phenoxy resins.