Solid-state imaging device and electronic apparatus
A solid-state imaging device includes a layout in which one sharing unit includes an array of photodiodes of 2 pixels by 4×n pixels (where, n is a positive integer), respectively, in horizontal and vertical directions.
1. A solid-state imaging device comprising:
a first structural unit including a first transfer transistor group sharing a first floating diffusion, the first transfer transistor group including four transfer transistors arranged around the first floating diffusion; and
a second structural unit including a second transfer transistor group sharing a second floating diffusion, the second transfer transistor group including four transfer transistors arranged around the second floating diffusion;
wherein the first and second floating diffusions are coupled to each other in a first direction,
wherein the first and second transfer transistor groups share at least an amplification transistor and a reset transistor, the amplification transistor coupled to a select transistor,
wherein a select wiring coupled to a gate electrode of the select transistor extends along the first direction, and
wherein a first power supply wiring coupled to a drain region of the reset transistor extends along a second direction different from the first direction.
2. The solid-state imaging device according to claim 1 , wherein a second power supply wiring coupled to a drain region of the amplification transistor extends along the first direction.
3. The solid-state imaging device according to claim 2 , wherein the first and second power supply wirings are formed in first and second layers respectively.
4. The solid-state imaging device according to claim 2 , wherein each gate electrode of the first and second transfer transistor groups is substantially triangular or trapezoidal in shape.
5. The solid-state imaging device according to claim 3 , wherein a reset wiring coupled to a gate electrode of the reset transistor extends along the second direction.
6. The solid-state imaging device according to claim 5 , wherein each gate electrode of the first and second transfer transistor groups is coupled to a readout wiring extending along the second direction.
7. The solid-state imaging device according to claim 6 , wherein a first connection wiring is coupled to the first floating diffusion, the second floating diffusion, an amplification gate electrode of the amplification transistor, and a source region of the reset transistor.
8. The solid-state imaging device according to claim 7 , wherein a third power supply wiring coupled to a drain region of the select transistor extends along the first direction.
9. The solid-state imaging device according to claim 8 , wherein a signal wiring coupled to a source region of the amplification transistor extends along the first direction.
10. The solid-state imaging device according to claim 9 , wherein a second connection wiring is formed in a transverse direction to connect with the select wiring.
11. The solid-state imaging device according to claim 10 , wherein the second connection wiring covers an entire width of the sharing unit.
12. The solid-state imaging device according to claim 11 , wherein readout wirings which are connected to readout gate electrodes are formed in the transverse direction.
13. The solid-state imaging device according to claim 12 , wherein the readout wirings are formed between adjacent pixels.
14. The solid-state imaging device according to claim 2 , wherein the amplification transistor has an active region comprising a source region of the amplification transistor, the drain region of the amplification transistor, and a channel region, wherein the active region extends from the source region to the drain region of the amplification transistor via the channel region, wherein the active region is formed in a cross shape, and wherein the amplification gate electrode is formed on a vertical portion of the channel region.
15. The solid-state imaging device according to claim 14 , wherein a reset gate electrode of the reset transistor is formed in a transverse direction with a length of two pixel pitches.
16. The solid-state imaging device according to claim 10 , wherein the first connection wiring, the second connection wiring, a select transistor power supply wiring, the select wiring, and the readout wirings are formed in a four-layer wiring structure.
17. An electronic apparatus comprising:
a solid-state imaging device comprising:
a first structural unit including a first transfer transistor group sharing a first floating diffusion, the first transfer transistor group including four transfer transistors arranged around the first floating diffusion; and
a second structural unit including a second transfer transistor group sharing a second floating diffusion, the second transfer transistor group including four transfer transistors arranged around the second floating diffusion;
wherein the first and second floating diffusions are coupled to each other in a first direction,
wherein the first and second transfer transistor groups share at least an amplification transistor and a reset transistor, the amplification transistor coupled to a select transistor,
wherein a select wiring coupled to a gate electrode of the select transistor extends along the first direction, and
wherein a first power supply wiring coupled to a drain region of the reset transistor extends along a second direction different from the first direction.