IP Library Granted Patent US 9,543,350
Granted Patent B2
US 9,543,350 · App. 14/853,071 · Granted Jan 10, 2017

Solid-state imaging device and camera including discrete trench isolation structure

Inventors: Kazuichiro Itonaga (Tokyo, JP); Yu Oya (Tokyo, JP)
Assignee: Sony Corporation
H01L27/14643H01L27/1463H01L27/14603H01L27/14609H01L27/14689H04N5/378
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,543,350
App. No.
14/853,071
Granted
Jan 10, 2017
Kind
B2
Abstract

A solid-state imaging device including is provided. The solid-state imaging device includes: pixels arrayed; a photoelectric conversion element in each of the pixels; a read transistor for reading electric charges photoelectrically-converted in the photoelectric conversion elements to a floating diffusion portion; a shallow trench element isolation region bordering the floating diffusion portion; and an impurity diffusion isolation region for other element isolation regions than the shallow trench element isolation region.

Claims (43)

1. An imaging device comprising:

a plurality of photoelectric conversion elements including a first photoelectric conversion element and a second photoelectric conversion element;

a floating diffusion portion;

a first transfer transistor configured to transfer charges generated in the first photoelectric conversion element to the floating diffusion portion;

an impurity diffusion isolation region formed between the first photoelectric conversion element and the second photoelectric conversion element; and

a first discrete trench isolation structure, wherein

the floating diffusion portion contacts a portion of the first discrete trench isolation structure,

a gate electrode of the first transfer transistor covers a portion of the first discrete trench isolation structure, and

the first discrete trench isolation structure is not in contact with the first photoelectric conversion element.

2. The imaging device according to claim 1 , further comprising a second transfer transistor configured to transfer charges generated in the second photoelectric conversion element to the floating diffusion portion.

3. The image device according to claim 1 , further comprising a reset transistor disposed between the floating diffusion portion and a predetermined voltage.

4. The imaging device according to claim 3 , wherein the first discrete trench isolation structure is in contact with the reset transistor.

5. The imaging device according to claim 3 , further comprising a selection transistor, wherein a gate electrode of the selection transistor is connected to the floating diffusion portion.

6. The imaging device according to claim 1 , wherein the first discrete trench isolation structure is formed by a shallow trench structure.

7. The image device according to claim 1 , wherein the gate electrode of the first transfer transistor includes polysilicon.

8. The imaging device according to claim 1 , wherein the impurity diffusion isolation region is different shape structure from the first discrete trench isolation structure.

9. The imaging device according to claim 1 , further comprising a planarized insulating film formed on the first discrete trench isolation structure and the impurity diffusion isolation region.

10. The imaging device according to claim 9 , wherein a film thickness of the planarized insulating film is greater than or equal to a film thickness of a gate-insulated film.

11. The imaging device according to claim 1 , wherein the first photoelectric conversion element is not directly in contact with the floating diffusion portion.

12. The imaging device according to claim 1 , further comprising a second discrete trench isolation structure on an opposite side of the floating diffusion as the first discrete trench isolation structure.

13. A camera device, comprising:

an optical system;

an imaging device including:

a plurality of photoelectric conversion elements having a first photoelectric conversion element and a second photoelectric conversion element,

a floating diffusion portion,

a first transfer transistor configured to transfer charges generated in the first photoelectric conversion element to the floating diffusion portion,

an impurity diffusion isolation region formed between the first photoelectric conversion element and the second photoelectric conversion element, and

a first discrete trench isolation structure; and

a signal processing circuit, wherein

the floating diffusion portion contacts a portion of the first discrete trench isolation structure,

a gate electrode of the first transfer transistor covers a portion of the first discrete trench isolation structure, and

the first discrete trench isolation structure is not in contact with the first photoelectric conversion element.

14. The camera device according to claim 13 , further comprising a second transfer transistor configured to transfer charges generated in the second photoelectric conversion element to the floating diffusion portion.

15. The camera device according to claim 13 , further comprising a reset transistor disposed between the floating diffusion portion and a predetermined voltage.

16. The camera device according to claim 15 , wherein the first discrete trench isolation structure is in contact with the reset transistor.

17. The camera device according to claim 15 , further comprising a selection transistor, wherein a gate electrode of the selection transistor is connected to the floating diffusion portion.

18. The camera device according to claim 13 , wherein the first discrete trench isolation structure is formed by a shallow trench structure.

19. The camera device according to claim 13 , wherein the gate electrode of the first transfer transistor includes polysilicon.

20. The camera device according to claim 13 , wherein the impurity diffusion isolation region is different shape structure from the first discrete trench isolation structure.

21. The camera device according to claim 13 , further comprising a planarized insulating film formed on the first discrete trench isolation structure and the impurity diffusion isolation region.

22. The camera device according to claim 21 , wherein a film thickness of the planarized insulating film is greater than or equal to a film thickness of a gate-insulated film.

23. The camera device according to claim 13 , wherein the first photoelectric conversion element is not directly in contact with the floating diffusion portion.

24. The camera device according to claim 13 , further comprising a second discrete trench isolation structure on an opposite side of the floating diffusion as the first discrete trench isolation structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2016
From: ITONAGA, KAZUICHIRO; OYA, YU
To: SONY CORPORATION
Reel/Frame 038642/0317 →
Priority Claims (1)
JP 2007-036620 · Feb 16, 2007 · national
Continuity (3)
Continuation 13659505 · Oct 24, 2012
Continuation 12003981 · Jan 4, 2008
Related Publication 20160005783A1 · Jan 7, 2016