Package structure and method for manufacturing same

1. A method of manufacturing a LED packaging structure comprising:

providing a support plate to be used as a substrate, the support plate includes a top surface and a bottom surface opposite to the top surface, the support plate further includes an annular recess formed on the top surface, a portion of the support plate surrounded by the annular recess is formed as a protruding portion;

forming a reflective layer on the surface of the annular recess and the edge of the protruding portion near the annular recess;

forming a wiring pattern on the top surface of the protruding portion;

forming an insulating layer to fill in the gaps of the wiring pattern and to fill in the annual recess;

forming a receiving groove on the position of the insulating layer corresponding to the position of the protruding portion after removing the support plate; and

accommodating a LED chip in the receiving groove, the LED chip with conductive pins are bonded on the wiring pattern by solder balls.

2. The method of manufacturing a LED package structure of claim 1 , wherein the method for forming an annular recess further comprises:

forming a first etching resist layer and a second etching resist layer respectively on the top surface and the bottom surface of the support plate, the first etching resist layer includes a first etching opening, and a portion of the top surface of the support plate not covered with the first etching resist layer, which is corresponding to the top surface of the support plate exposed from the first etching opening, is etched to form the annular recess; and

removing the first etching resist layer and the second etching resist layer, wherein the cross section of the annular recess is trapezoidal shaped;

wherein the width of the annular recess is gradually decreased in a direction from the opening of the annular recess to the bottom of the annular recess;

wherein the width of the opening for the annular recess on the top surface is larger than the width of the first etching opening.

3. The method of manufacturing a LED package structure of claim 1 , wherein the method for manufacturing the annular recess is laser ablation, wherein the cross section of the annular recess is trapezoidal shaped, and the width of the opening for the annular recess on the top surface is gradually decreased in a direction from the opening of the annular recess to the bottom of the annular recess.

4. The method of manufacturing a LED packaging structure of claim 1 , wherein the material of the reflective layer is made of nickel, nickel-gold, or nickel-chromium, and the method for forming the reflective layer further comprising:

forming a first protection layer and a second protection layer respectively on the top surface and the bottom surface of the support plate, the first protection layer defines a first annular opening, the annular recess and the top surface of the protruding portion near the annular recess are exposed from the first annular opening;

forming the reflective layer on the top surface of the support plate exposed from the first annular opening and on the bottom and side surfaces of the annular recess; and

removing the first protection layer and the second protection layer.

5. A method of manufacturing a LED package structure of claim 1 , wherein the method for forming the wiring pattern comprises:

forming a third protection layer and a fourth protection layer respectively on the top surface and the bottom surface, the third protection layer covers a portion of the top surface and fills in the annular recess, the third protection layer defines a plurality of second openings and a portion of the protruding portion is exposed from the second openings which is corresponding to the wiring pattern;

plating the wiring pattern on the top surface and the surface of the reflective layer which are exposed from the plurality of second openings by a coating method; and

removing the third protection layer and the fourth protection layer;

wherein the coating method for the wiring pattern is selected from one of electroplating, sputtering, or chemical plating.

6. The method of manufacturing a LED package structure of claim 1 , wherein the material of the insulating layer is an epoxy molding compound, the method for forming the insulating layer comprises:

placing the support plate with the wiring pattern into a mold;

injecting the epoxy molding compound into the mold for covering the top surface of the supporting plat and filling in the annular recess and the gaps of the wiring pattern;

curing the epoxy molding compound; and

grinding the surface of the epoxy molding compound away from the support plate for forming the insulating layer,

wherein the surface of the insulating layer away from the support plate is flush with the surface of the wiring pattern away from the support plate and the wiring pattern is exposed to the insulating layer.

7. The method of manufacturing a LED package structure of claim 1 , wherein the method for removing the support plate comprises:

laminating a third etching resist layer on one surface of the insulating layer away from the support plate;

removing the support plate by etching, wherein the insulating layer, the reflective layer and the wiring pattern covered by the reflective layer are not etched, and a portion of the wiring pattern not covered with the reflective layer is etched in a direction of thickness; and

removing the third etching resist layer.

8. The method of manufacturing a LED package structure of claim 1 , wherein the method after accommodating the LED chip in the receiving groove and bonding the LED chip to the wiring pattern further comprises:

Encapsulating the bottom and surrounding of the LED chip with an encapsulation resin containing fluorescent powders for the light wavelength conversion.

9. A method of manufacturing a LED package structure of claim 1 , wherein the wiring pattern includes a plurality of first conductive blocks and a plurality of second conductive blocks, the plurality of first conductive blocks are formed on a portion of the surface of the reflective layer positioned on the protruding portion near the annular recess, the second conductive blocks are formed on the top surface of the support plate corresponding to the surface of the protruding portion not covered with the reflective layer.

10. The method of manufacturing a LED packaging structure of claim 9 , wherein the LED chip with conductive pins is bonded to the second conductive blocks, after soldering the LED, the method for manufacturing a LED package structure further comprises:

bonding a driving module and an electrostatic protection module to the second conductive blocks away from the receiving groove by soldering; and

forming the solder balls on the surfaces of the first conductive blocks away from the receiving groove.

11. The method of manufacturing a LED package structure of claim 9 , wherein the wiring pattern further comprises a plurality of heat dissipation conductive blocks, the plurality of heat dissipation conductive blocks are formed on a portion of the surface of the reflective layer positioned on the protruding portion near the annular recess, and the plurality of the heat dissipation conductive blocks form a plurality of heat dissipation channels.