Semiconductor device and method of fabricating the same
A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region.
1. A semiconductor device comprising:
a semiconductor substrate:
a semiconductor active region on a surface of the semiconductor substrate, wherein the semiconductor active region protrudes away from the surface of the semiconductor substrate; and
an isolation layer on the surface of the semiconductor substrate to define the semiconductor active region, wherein a top surface level of the isolation layer is lower than a top surface level of the semiconductor active region;
wherein a first portion of a sidewall of the semiconductor active region below the surface of the isolation layer has a first slope,
wherein a second portion of the sidewall of the semiconductor active region beyond the surface of the isolation layer has a second slope different than the first slope, and
wherein a third portion of the sidewall of the semiconductor active region beyond the surface of the isolation layer has a third slope different than the first and second slopes.
2. The semiconductor device of claim 1 further comprising:
a gate structure on the second and third portions of the sidewall of the semiconductor active region.
3. The semiconductor device of claim 2 wherein the sidewall of the semiconductor active region is a first sidewall of the semiconductor active region, wherein the semiconductor active region has a second sidewall, and wherein the gate structure extends across the semiconductor active region on the first and second sidewalls on opposite sides of the semiconductor active region.
4. The semiconductor device of claim 3 wherein the gate structure includes an insulating layer.
5. The semiconductor device of claim 2 wherein the sidewall of the semiconductor active region is a first sidewall of the semiconductor active region, wherein the semiconductor active region has a second sidewall, and wherein the gate structure includes a gate electrode extending across the semiconductor active region on the first and second sidewalls on opposite sides of the semiconductor active region and an insulating layer between the gate electrode and the semiconductor active region.
6. The semiconductor device of claim 1 wherein the semiconductor active region has a fin-type structure.
7. The semiconductor device of claim 1 wherein the isolation layer comprises a trench isolation layer.
8. The semiconductor device of claim 1 wherein the sidewall is a first sidewall, wherein the semiconductor active region includes a second sidewall and a top surface between the first and second sidewalls, and wherein the second and third portions of the first sidewall is spaced apart from the top surface of the semiconductor active region.
9. The semiconductor device of claim 8 wherein the second portion of the first sidewall is spaced apart from the top surface of the semiconductor active region by a first distance, wherein the second portion of the first sidewall is spaced apart from the surface of the isolation layer by a second distance, and wherein the first distance is greater than the second distance, and
wherein the third portion of the first sidewall is spaced apart from the top surface of the semiconductor active region by a third distance, wherein the third portion of the first sidewall is spaced apart from the surface of the isolation layer by a fourth distance, and wherein the third distance is greater than the fourth distance.
10. The semiconductor device of claim 8 wherein the second portion of the first sidewall is spaced apart from the top surface of the semiconductor active region by a first distance, wherein the second portion of the first sidewall is spaced apart from the surface of the isolation layer by a second distance, and wherein the first distance is less than the second distance, and
wherein the third portion of the first sidewall is spaced apart from the top surface of the semiconductor active region by a third distance, wherein the third portion of the first sidewall is spaced apart from the surface of the isolation layer by a fourth distance, and wherein the third distance is less than the fourth distance.
11. The semiconductor device of claim 8 wherein the top surface of the semiconductor active region is rounded to define a rounded top surface.
12. The semiconductor device of claim 11 wherein a first bend is defined in the sidewall between the first and second slopes, and wherein the first bend is spaced apart from the rounded top surface, and
wherein a second bend is defined in the sidewall between the second and third slopes, and wherein the second bend is spaced apart from the rounded top surface.
13. The semiconductor device of claim 1 wherein a first bend is defined in the sidewall between the first and second slopes, and
wherein a second bend is defined in the sidewall between the second and third slopes.
14. The semiconductor device of claim 1 wherein the first slope is greater than the second slope, and
wherein the second slope is greater than the third slope.
15. The semiconductor device of claim 1 wherein the semiconductor substrate comprises at least one of silicon, silicon germanium, and/or germanium.
16. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor active region on a surface of the semiconductor substrate, wherein the semiconductor active region protrudes from the semiconductor substrate; and
an isolation layer on the surface of the semiconductor substrate to define the semiconductor active region,
wherein the semiconductor active region protrudes above a surface of the isolation layer,
wherein a first portion of a sidewall of the semiconductor active region extending from below the surface of the isolation layer to the surface of the isolation layer has a first slope,
wherein a second portion of the sidewall of the semiconductor active region extending from the surface of the isolation layer to above the surface of the isolation layer has a second slope that is different than the first slope,
wherein a third portion of the sidewall of the semiconductor active region above the surface of the isolation layer has a third slope that is different than the first and second slopes.
17. The semiconductor device of claim 16 , wherein the first portion and the second portion are formed by a first etching process.
18. The semiconductor device of claim 16 , wherein a first bend point in the sidewall of the semiconductor active region is located between the first portion and the second portion.
19. The semiconductor device of claim 18 wherein the first bend point is located at the surface of the isolation layer.
20. The semiconductor device of claim 18 , wherein the first bend point separates two substantially planar sidewalls of the semiconductor active region.
21. The semiconductor device of claim 16 , wherein the semiconductor active region has a bend point in the sidewall of the semiconductor active region between the second portion and the third portion.
22. The semiconductor device of claim 21 , wherein the bend point is formed by at least one etching process.
23. The semiconductor device of claim 16 , wherein the semiconductor active region has a fin-type structure.
24. The semiconductor device of claim 16 , wherein the semiconductor active region includes at least one doped region.
25. The semiconductor device of claim 16 , further comprising:
a gate structure on the semiconductor active region.
26. The semiconductor device of claim 25 , wherein the gate structure is a finfet gate structure.
27. The semiconductor device of claim 25 wherein the sidewall of the semiconductor active region includes a bend point adjacent to the surface of the isolation layer.
28. The semiconductor device of claim 16 wherein the semiconductor substrate, the first portion, the second portion and the third portion are made of the same material and wherein the third portion is capped by a top rounded surface.
29. The semiconductor device of claim 16 :
wherein the sidewall of the semiconductor active region includes at least two bend points, and
wherein the semiconductor active region includes a top surface.
30. The semiconductor device of claim 16 wherein the sidewall of the semiconductor active region comprises a first sidewall, the device further comprising:
a second sidewall of the semiconductor active region opposite the first sidewall; and
a rounded top surface of the semiconductor active region extending from the first sidewall to the second sidewall and wherein the rounded top surface includes no flat portion.