Dielectric film defect reduction

1. A method of depositing a dielectric layer within a reaction chamber including a first electrode configured to support a substrate and a second electrode disposed above the first electrode and the substrate, the method comprising:

performing a deposition operation followed by a termination operation, wherein the deposition operation includes:

flowing at least one reactant gas and at least one dilution gas into the reaction chamber;

applying a first radio frequency (RF) power to the first electrode and a second RF power to the second electrode; and

providing a first maximum low frequency radio frequency (LFRF) reflective power during the deposition operation depositing a dielectric layer on the substrate;

after the depositing the dielectric layer on the substrate starting the termination operation including stopping a flow of the at least one reactant gas;

changing an impedance provided by an impedance matching unit coupled to the second electrode during the termination operation; and

wherein the changing the impedance provides a second maximum LFRF reflective power during the termination operation wherein the second maximum LFRF reflective power less than the first maximum LFRF reflective power.

2. The method of claim 1 , wherein the at least one reactant gas is selected from the group consisting of silane, diethylsilane, ammonia, oxygen, nitrous oxide, a fluorocarbon, 4MS, carbon dioxide, and/or tetraethylorthosilicate (TEOS).

3. The method of claim 1 , wherein the at least one dilution gas is selected from the group consisting of argon, nitrogen, and helium.

4. The method of claim 1 , wherein the dielectric layer is selected from the group consisting of silicon oxide, silicon nitride, and siliconoxynitride.

5. The method of claim 1 , wherein the providing the second maximum LFRF reflective power during the termination operation further comprises:

performing a process selected from the group consisting of stopping flow of the at least one reactant gas into the reaction chamber, and applying a different power to the reaction chamber.

6. The method of claim 1 , wherein:

the providing the first maximum low frequency radio frequency (LFRF) reflective power includes applying a first tap setting to the impedance matching unit coupled to the second electrode; and

changing the impedance provided by the impedance matching unit includes applying a second tap setting to the impedance matching unit coupled to the second electrode, the second tap setting different than the first tap setting.

7. The method of claim 1 , wherein

the applying the first RF power includes applying low frequency RF (LFRF) power to the first electrode;

the applying the second RF power includes applying high frequency RF (HFRF) power to the second electrode; and

forming a plasma between the first and second electrodes.

8. A method of depositing a dielectric layer within a reaction chamber including a first electrode configured to support a substrate and a second electrode disposed above the first electrode and the substrate, the method comprising:

flowing at least one reactant gas and at least one dilution gas into the reaction chamber;

applying a first low frequency radio frequency (LFRF) power to the first electrode of the reaction chamber to form a plasma between the first and second electrodes and to deposit a dielectric layer on the substrate during a deposition operation, wherein there is a first maximum LFRF reflective power during the deposition operation;

after the depositing the dielectric layer on the substrate, performing a termination operation;

applying the first LFRF power to the first electrode during the termination operation;

providing a second maximum LFRF reflective power during the termination operation while applying the first LFRF power, wherein the second maximum LFRF reflective power is less than the first maximum LFRF reflective power, wherein the providing the second maximum LFRF reflective power includes changing at least one of an impedance provided by an impedance matching unit coupled to one of the first and second electrodes, stopping a flow of the at least one dilution gas, and changing a pressure in the reaction chamber.

9. The method of claim 8 , wherein the at least one reactant gas is selected from the group consisting of silane, diethylsilane, ammonia, oxygen, nitrous oxide, a fluorocarbon, 4MS, carbon dioxide, and/or tetraethylorthosilicate (TEOS).

10. The method of claim 8 , wherein the at least one dilution gas is selected from the group consisting of argon, nitrogen, and helium.

11. The method of claim 8 , wherein the dielectric layer is selected from the group consisting of silicon oxide, silicon nitride, and siliconoxynitride.

12. The method of claim 8 , wherein the providing the second maximum LFRF reflective power includes:

changing a tap setting to the impedance matching unit coupled to the second electrode.

13. The method of claim 12 , wherein the tap setting is provided during the depositing the dielectric layer to provide the first maximum LFRF reflective power of about 70 watts and wherein the tap setting provides the second maximum LFRF reflective power of about 22 watts during the termination operation.

14. The method of claim 8 , further comprising:

applying a high frequency RF (HFRF) power to the second electrode of the reaction chamber during the depositing and the termination operation.

15. The method of claim 8 , further comprising:

during the depositing the dielectric layer on the substrate, providing the chamber pressure between about 2 Torr and about 3 Torr; and

during the depositing the dielectric layer on the substrate, providing a chamber temperature between about 300 degrees Celsius and about 400 degrees Celsius.

16. A method of depositing a dielectric layer within a reaction chamber including a first electrode configured to support a substrate and a second electrode disposed above the first electrode and the substrate, the method comprising:

flowing at least one reactant gas and at least one dilution gas into the reaction chamber;

providing a first chamber pressure;

applying a first tap setting to an impedance matching unit coupled to the second electrode;

applying a low frequency radio frequency (LFRF) power to the first electrode of the reaction chamber to form a plasma between the first and second electrodes and to deposit a dielectric layer on the substrate during a deposition operation;

wherein during the deposition operation a first maximum LFRF reflective power is provided;

after the depositing the dielectric layer on the substrate, providing a second chamber pressure during a termination operation;

continuing applying the LFRF power to the first electrode while applying a second tap setting to the impedance matching unit coupled to the second electrode during the termination operation, the second tap setting different than the first tap setting; and

wherein the second tap setting provides a second maximum LFRF reflective power during the termination operation,

wherein the second maximum LFRF reflective power is less than the first maximum LFRF reflective power during the termination operation.

17. The method of claim 1 , further comprising:

during the termination operation and providing the second maximum reflective LFRF power, applying the first power to the first electrode and the second power to the second electrode.

18. The method of claim 1 , wherein the second maximum reflective LFRF power is approximately 20 Watts.

19. The method of claim 16 , further comprising applying a power of a first wattage to the second electrode of the reaction chamber to form the plasma during the depositing, and continuing to apply the power of the first wattage to the second electrode during the termination operation.

20. The method of claim 8 , further comprising: applying a high frequency radio frequency (HFRF) power to the second electrode of the reaction chamber during the depositing and the termination operation, wherein a same wattage of HFRF power is applied during the depositing and the termination operation.