Manufacturing method of graphene modulated high-K oxide and metal gate MOS device
A manufacturing method of a graphene modulated high-k oxide and metal gate Ge-based MOS device, which comprises the following steps: 1) introducing a graphene thin film on a Ge-based substrate; 2) conducting fluorination treatment to the graphene thin film to form fluorinated graphene; 3) activating the surface of the fluorinated graphene by adopting ozone plasmas, and then forming a high-k gate dielectric on the surface of the fluorinated graphene through an atomic layer deposition technology; and 4) forming a metal electrode on the surface of the high-k gate dielectric. Since the present invention utilizes the graphene as a passivation layer to inhibit the formation of unstable oxide GeO x on the surface of the Ge-based substrate and to stop mutual diffusion between the gate dielectric and the Ge-based substrate, the interface property between Ge and the high-k gate dielectric layer is improved. The fluorinated graphene can enable the graphene to become a high-quality insulator on the basis of keeping the excellent property of the graphene, so that the influence thereof on the electrical property of the Ge-based device is reduced. By adopting the ozone plasmas to treat the Ge-based graphene and then by adopting the atomic layer deposition technology, an ultrathin Hf-based high-k gate dielectric layer can be obtained.
1. A manufacturing method of a graphene modulated high-k oxide and metal gate Ge-based MOS device, characterized in that the manufacturing method at least comprises the following steps:
1) introducing a graphene thin film on a Ge-based substrate, the graphene thin film is used as a passivation layer to inhibit the formation of instable oxide GeOx in the Ge-based substrate and to stop mutual diffusion between the high-k gate dielectric and the Ge-based substrate;
2) conducting fluorination treatment to the graphene thin film to form a fluorinated graphene insulating thin layer;
3) activating the surface of the fluorinated graphene by adopting ozone plasmas, and then forming a high-k gate dielectric on the surface of the fluorinated graphene through an atomic layer deposition technology;
4) forming a metal electrode on the surface of the high-k gate dielectric.
2. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that the manufacturing method further comprises the following steps:
5) removing part of the metal electrode, the high-k gate dielectric and the fluorinated graphene to form a gate structure of the MOS device;
6) forming a source region and a drain region through an ion implantation technology;
7) manufacturing a source region electrode and a drain region electrode.
3. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that the step 1 comprises the following steps:
1-1) growing the graphene thin film on the metal substrate;
1-2) transferring the graphene thin film onto the Ge-based substrate;
1-3) annealing to enhance the bonding of the graphene thin film and the Ge-based substrate.
4. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that, in the step 1, a chemical vapor deposition method is adopted to grow the graphene thin film in situ on the surface of the Ge-based substrate.
5. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that, in the step 2, XeF 2 gas is adopted to conduct plasma fluorination treatment to the graphene thin film.
6. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that the material of the high-k gate dielectric is an Hf-based dielectric.
7. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that, in the step 4, a physical vapor deposition method is adopted to form the metal electrode, wherein the metal electrode is a Pt electrode.
8. The manufacturing method of the graphene modulated high-k oxide and metal gate Ge-based MOS device according to claim 1 , characterized in that, after the step 4, the manufacturing method further comprises a step of annealing in an N 2 and O 2 atmosphere and conducting interface diffusion and electrical property testing.