Imprint apparatus including alignment and overlay measurement
An imprint apparatus cures an imprint material, while a pattern formed on a mold is kept in contact with the imprint material, thereby transferring the pattern onto the imprint material. The apparatus includes a measurement unit which performs, in parallel, alignment measurement in which a relative position between the mold and a shot region on the substrate, to which the pattern is to be transferred, is measured so as to align the mold and the shot region, and overlay measurement in which a relative position between a first pattern already formed in another shot region on the substrate using the mold, and a second pattern underlying the first patter is measured.
1. An imprint apparatus for forming a pattern on a substrate by imprinting, the imprint apparatus comprising:
a measurement unit including a scope having a field of view and configured to perform:
alignment measurement where a relative position between the mold and a shot region on the substrate is measured to align the mold and the shot region; and
overlay measurement where a relative position between a first pattern already formed in a shot region on the substrate using the mold, and a second pattern in the substrate underlying the first pattern is measured; and
a control unit configured to cause the measurement unit to perform, in parallel, the alignment measurement for a shot region to be imprinted on the substrate and the overlay measurement for a shot region on which a pattern has been formed on the substrate by imprinting, using a mark in the substrate and a mark in the mold for the alignment measurement for the shot region to be imprinted and an overlay measurement mark in the substrate for the overlay measurement for the shot region on which the pattern has been formed by imprinting falling within the field of view of the scope, the overlay measurement mark comprising a mark in the first pattern and a mark in the second pattern.
2. The apparatus according to claim 1 , wherein the control unit is configured to control the measurement unit so that a shot region to undergo the overlay measurement is adjacent to a shot region to undergo the alignment measurement.
3. The apparatus according to claim 1 , wherein the control unit is configured to control the measurement unit so that the overlay measurement is performed for a shot region that has not yet undergone the overlay measurement after the pattern is formed on the last shot region on the substrate.
4. The apparatus according to claim 1 , wherein the control unit is configured to control the measurement unit so that a mark on the substrate to be used for the overlay measurement is different from a mark on the substrate to be used for the alignment measurement.
5. The apparatus according to claim 1 , wherein the control unit is configured to control the measurement unit so that a mark on the substrate to be used for the overlay measurement is identical to a mark on the substrate to be used for the alignment measurement.
6. The apparatus according to claim 1 , wherein:
imprinting is performed for a plurality of shot regions on the substrate, and
the control unit is configured to cause the measurement unit to perform the overlay measurement for a last shot region imprinted last, from among the plurality of shot regions, after the last shot region is imprinted.
7. The apparatus according to claim 1 , further comprising an output unit configured to output warning information based on the overlay measurement.
8. The apparatus according to claim 1 , further comprising a transfer unit configured to transfer a result of the overlay measurement to a host computer.
9. An imprint apparatus for forming a pattern on a substrate by imprinting, the apparatus comprising:
a measurement unit configured to perform:
alignment measurement to measure a relative position between the mold and a shot region on the substrate to align the mold and the shot region; and
overlay measurement to measure a relative position between a first alignment mark already formed in a shot region on the substrate using the mold and a second alignment mark in the substrate underlying the first alignment mark; and
a control unit configured to cause the measurement unit to perform in parallel:
the overlay measurement for a first shot region on the substrate, for which the first alignment mark has been formed on the substrate by imprinting using the mold; and
the alignment measurement for a second shot region on the substrate, for which a pattern is to be formed on the substrate by imprinting using the mold,
wherein the alignment measurement for the first shot region is performed using an alignment mark on the substrate for the first shot region and an alignment mark on the mold, and
wherein the overlay measurement for the first shot region is performed using an overlay measurement mark constituted by the second alignment mark in the substrate for the first shot region and the first alignment mark formed by the alignment mark on the mold by imprinting on the first shot region.
10. The apparatus according to claim 9 , wherein:
the measurement unit includes scopes, and
the control unit is configured to cause the measurement unit to perform the alignment measurement and the overlay measurement in parallel using the scopes.
11. The apparatus according to claim 9 , wherein the control unit is configured to control the measurement unit so that a shot region to undergo the overlay measurement is adjacent to a shot region to undergo the alignment measurement.
12. The apparatus according to claim 9 , wherein the control unit is configured to control the measurement unit so that the overlay measurement is performed for a shot region that has not yet undergone the overlay measurement after the pattern is formed on the last shot region on the substrate.
13. The apparatus according to claim 9 , wherein:
imprinting is performed for a plurality of shot regions on the substrate, and
the control unit is configured to cause the measurement unit to perform the overlay measurement for a last shot region imprinted last, from among the plurality of shot regions, after the last shot region is imprinted.
14. The apparatus according to claim 9 , further comprising an output unit configured to output warning information based on the overlay measurement.
15. The apparatus according to claim 9 , further comprising a transfer unit configured to transfer a result of the overlay measurement to a host computer.
16. A method of manufacturing an article, the method comprising the steps of:
forming a pattern on a substrate by imprinting using an imprint apparatus; and
processing the substrate having the pattern formed thereon, wherein the imprint apparatus comprises:
a measurement unit including a scope having a field of view and configured to perform:
alignment measurement where a relative position between the mold and a shot region on the substrate is measured to align the mold and the shot region; and
overlay measurement where a relative position between a first pattern already formed in a shot region on the substrate using the mold, and a second pattern in the substrate underlying the first pattern is measured; and
a control unit configured to cause the measurement unit to perform, in parallel, the alignment measurement for a shot region to be imprinted on the substrate and the overlay measurement for a shot region on which a pattern has been formed on the substrate by imprinting, using a mark in the substrate and a mark in the mold for the alignment measurement mark in the substrate for the shot region to be imprinted and an overlay measurement mark in the substrate for the overlay measurement for the shot region on which the pattern has been formed by imprinting falling within the field of view of the scope, the overlay measurement mark comprising a mark in the first pattern and a mark in the second pattern.