Semiconductor device having a fuse element
A portion-to-be-melted of a fuse is surrounded by plates, so that heat to be generated in a meltdown portion of the fuse under current supply can be confined or accumulated in the vicinity of the meltdown portion of the fuse. This makes it possible to facilitate meltdown of the fuse. The meltdown portion of the fuse in a folded form, rather than in a single here a fuse composed of a straight-line form, is more successful in readily concentrating the heat generated in the fuse under current supply into the meltdown portion, and in further facilitating the meltdown of the fuse.
1. A semiconductor device, comprising:
a substrate;
an insulating layer formed over the substrate;
a first conductive plate formed in the insulating layer and formed at a first wiring layer;
a fuse element formed in the insulating layer and formed at a second wiring layer, the second wiring layer being one level above the first wiring layer; and
a second conductive plate formed in the insulating layer and formed at a third wiring layer, the third wiring layer being one level above the second wiring layer;
wherein the fuse element includes copper,
wherein the fuse element is brought into a blow state by a current supplied thereto,
wherein the fuse element has a first portion including a meltdown portion and a second portion that is wider than the first portion,
wherein the first portion is bent a plurality of times,
wherein the first conductive plate is formed below the fuse element in a planar view, and
wherein the second conductive plate is formed above the fuse element in the planar view.
2. A semiconductor device according to claim 1 ,
wherein the fuse element is electrically isolated from the first conductive plate.
3. A semiconductor device according to claim 1 ,
wherein the fuse element is electrically isolated from the second conductive plate.
4. A semiconductor device according to claim 1 ,
wherein the current to the fuse element is supplied from the second portion to the first portion.
5. A semiconductor device according to claim 1 ,
wherein the second portion is comprised of at least one of i) a current entrance terminal located at one end of the first portion and ii) a current exit terminal located at another end of the first portion, and
wherein the first portion that is bent a plurality of times is comprised of a plurality of serially connected bent units, each said bent unit being comprised of forward straight portion, a backward straight portion, and a normal connection portion which connects the forward straight portion and the backward straight portion, the backward straight portion running in a direction opposite to a direction of the forward straight portion.
6. A semiconductor device according to claim 5 ,
wherein the fuse element is electrically isolated from the first conductive plate.
7. A semiconductor device according to claim 5 ,
wherein the fuse element is electrically isolated from the second conductive plate.
8. A semiconductor device according to claim 5 ,
wherein the current to the fuse element is supplied from the second portion to the first portion.
9. A semiconductor device according to claim 5 ,
wherein the second portion is comprised of both of i) a current entrance terminal located at one end of the first portion and ii) a current exit terminal located at another end of the first portion, and
wherein the current with the fuse element runs from the current entrance terminal through the second portion to the current exit terminal.
10. A semiconductor device according to claim 9 ,
wherein the fuse element is electrically isolated from the second conductive plate.
11. A semiconductor device according to claim 1 ,
wherein the first portion that is bent a plurality of times is comprised of a plurality of serially connected bent units, each said bent unit being comprised of forward straight portion, a backward straight portion, and a normal connection portion which connects the forward straight portion and the backward straight portion, the backward straight portion running in a direction opposite to a direction of the forward straight portion.
12. A semiconductor device according to claim 11 ,
wherein the fuse element is electrically isolated from the first conductive plate.
13. A semiconductor device according to claim 11 ,
wherein the current to the fuse element is supplied from the second portion to the first portion.
14. A semiconductor device according to claim 11 ,
wherein the second portion is comprised of both of i) a current entrance terminal located at one end of the first portion and ii) a current exit terminal located at another end of the first portion, and
wherein the current with the fuse element runs from the current entrance terminal through the second portion to the current exit terminal.