Detachable high-temperature electrostatic chuck assembly
View Patent ↗A detachable high-temperature electrostatic chuck assembly including a chuck body for supporting a substrate, an interface plate coupled to the chuck body by a sealing ring, the sealing ring defining a pocket between the chuck body and the interface plate that is sealed from a surrounding vacuum environment, and a cooling plate disposed between the chuck body and the interface plate. An interface between the chuck body and the cooling plate is located within the pocket.
1. An electrostatic chuck assembly comprising:
a chuck body for supporting a substrate;
an interface plate coupled to the chuck body by a sealing ring, the sealing ring defining an enclosed volume disposed entirely on a backside of the chuck body between the chuck body and the interface plate;
a cooling plate disposed between the chuck body and the interface plate, wherein an interface between the chuck body and the cooling plate is located within the enclosed volume; and
a lift pin assembly including a lift pin bellows extending through the enclosed volume between the interface plate and a lift pin aperture in the chuck body, and an axially displaceable lift pin disposed within the lift pin bellows, wherein an internal volume of the lift pin bellows is fluidically sealed from the enclosed volume.
2. The electrostatic chuck assembly of claim 1 , wherein the enclosed volume is a pocket that is fluidically sealed from a surrounding vacuum environment.
3. The electrostatic chuck assembly of claim 1 , further comprising a backside gas assembly including a backside gas bellows extending through the enclosed volume between a backside gas supply line and a backside gas outlet in the chuck body, wherein an internal volume of the backside gas bellows is fluidically sealed from the enclosed volume.
4. The electrostatic chuck assembly of claim 1 , further comprising a fluid conduit embedded within the cooling plate and having a fluid inlet port and a fluid outlet port, the fluid conduit configured to circulate a cooling fluid for cooling the cooling plate.
5. The electrostatic chuck assembly of claim 1 , further comprising a heat transfer layer disposed between the cooling plate and the chuck body.
6. The electrostatic chuck assembly of claim 5 , wherein the heat transfer layer includes at least one of a perfluoroelastomer material and a flexible graphite material.
7. The electrostatic chuck assembly of claim 1 , wherein the chuck body includes a pair of flatly abutting layers that are bonded together, and a grounding circuit disposed between the pair of flatly abutting layers.
8. The electrostatic chuck assembly of claim 7 , further comprising a ground pin assembly including an electrically conductive, movable ground pin extending through a ground pin aperture in the chuck body, the ground pin being electrically coupled to the grounding circuit.
9. The electrostatic chuck assembly of claim 8 , wherein the ground pin is electrically coupled to the grounding circuit via a ground electrode that extends through the chuck body.
10. The electrostatic chuck assembly of claim 7 , further comprising an electrically conductive sealing ring on a chucking surface of the chuck body, wherein the electrically conductive sealing ring is electrically connected to the grounding circuit by a grounding conductor that extends through the chuck body.
11. The electrostatic chuck assembly of claim 1 , further comprising a supporting ring extending through the cooling plate between the interface plate and the chuck body for limiting displacement of the chuck body relative to the interface plate.
12. An electrostatic chuck assembly comprising:
a chuck body for supporting a substrate;
an interface plate coupled to the chuck body by a sealing ring, the sealing ring defining an enclosed volume disposed entirely on a backside of the chuck body between the chuck body and the interface plate, wherein the enclosed volume is a pocket that is fluidically sealed from a surrounding vacuum environment;
a cooling plate disposed between the chuck body and the interface plate, wherein an interface between the chuck body and the cooling plate is located within the enclosed volume a backside gas assembly including a backside gas bellows extending through the enclosed volume between a backside gas supply line and a backside gas outlet in the chuck body, wherein an internal volume of the backside gas bellows is fluidically sealed from the enclosed volume; and
a lift pin assembly including a lift pin bellows extending through the enclosed volume between the interface plate and a lift pin aperature in the chuck body, and an axially displaceable lift pin disposed within the lift pin bellows, wherein an internal volume of the lift pin bellows is fluidically sealed from the enclosed volume.
13. The electrostatic chuck assembly of claim 12 , further comprising a fluid conduit embedded within the cooling plate and having a fluid inlet port and a fluid outlet port, the fluid conduit configured to circulate a cooling fluid for cooling the cooling plate.
14. The electrostatic chuck assembly of claim 12 , further comprising a heat transfer layer disposed between the cooling plate and the chuck body.
15. The electrostatic chuck assembly of claim 12 , wherein the heat transfer layer includes at least one of a perfluoroelastomer material and a flexible graphite material.
16. The electrostatic chuck assembly of claim 12 , wherein the chuck body includes a pair of flatly abutting layers that are bonded together, and a grounding circuit disposed between the pair of flatly abutting layers.
17. The electrostatic chuck assembly of claim 16 , further comprising a ground pin assembly including an electrically conductive, movable ground pin extending through a ground pin aperture in the chuck body, the ground pin being electrically coupled to the grounding circuit.
18. The electrostatic chuck assembly of claim 17 , wherein the ground pin is electrically coupled to the grounding circuit via a ground electrode that extends through the chuck body.
19. The electrostatic chuck assembly of claim 16 , further comprising an electrically conductive sealing ring on a chucking surface of the chuck body, wherein the electrically conductive sealing ring is electrically connected to the grounding circuit by a grounding conductor that extends through the chuck body.
20. The electrostatic chuck assembly of claim 12 , further comprising a supporting ring extending through the cooling plate between the interface plate and the chuck body for limiting displacement of the chuck body relative to the interface plate.
21. A high-temperature electrostatic chuck assembly comprising:
a chuck body for supporting a substrate;
an interface plate coupled to the chuck body by a sealing ring, the sealing ring defining an enclosed volume disposed entirely on a backside of the chuck body between the chuck body and the interface plate;
a cooling plate disposed between the chuck body and the interface plate, an interface between the chuck body and the cooling plate being located within the enclosed volume;
a lift pin assembly including a lift pin bellows extending through the cooling plate between the interface plate and a lift pin aperture in the chuck body, and further including an axially displaceable lift pin disposed within the lift pin bellows, an internal volume of the lift pin bellows fluidically sealed from the enclosed volume; and
a backside gas assembly including a backside gas bellows extending through the cooling plate between a backside gas supply line and a backside gas outlet in the chuck body, wherein an internal volume of the backside gas bellows is fluidically sealed from the enclosed volume.