Substrate processing apparatus, etching method of metal film, and manufacturing method of magnetoresistive effect element
In order to easily exchange a depleted dielectric member in a substrate processing apparatus, a faraday shield provided opposite to an antenna across a component member made of a dielectric, a first dielectric member provided opposite to the antenna across the component member and the faraday shield, and a second dielectric member provided opposite to the antenna across the component member, the faraday shield, and the first dielectric member are provided, and the second dielectric member is placed on a protrusion part formed on a vacuum container in the substrate processing apparatus.
1. A substrate processing apparatus comprising:
a vacuum container having a processing space in which a substrate is processed and a plasma forming space in which plasma is formed;
a component member made of a dielectric which is part of the vacuum container and configures at least part of the plasma forming space;
a conductive member fixed on the component member;
a faraday shield fixed on the plasma forming space side of the component member;
a first dielectric member coating the plasma forming space side of the faraday shield; and
a second dielectric member provided on the plasma forming space side of the first dielectric member,
wherein the conductive member is provided on the component member on a side opposite to the plasma forming space side,
wherein the faraday shield is fixed to a position opposite to the conductive member with the component member therebetween,
wherein the first dielectric member is formed to coat the faraday shield so that the faraday shield has a floating potential,
wherein the second dielectric member is provided at a position opposite to the faraday shield with the first dielectric member therebetween, and
wherein the vacuum container has a protrusion part, and the second dielectric member is exchangeably provided on the protrusion part.
2. The substrate processing apparatus according to claim 1 , wherein the second dielectric member is placed on the protrusion part.
3. The substrate processing apparatus according to claim 1 or 2 , wherein the first dielectric member is formed by spraying.
4. The substrate processing apparatus according to claim 1 or 2 , wherein the faraday shield is formed by spraying.
5. The substrate processing apparatus according to claim 4 , wherein an intermediate layer whose thermal expansion coefficient is higher than the faraday shield and lower than the component member is present between the faraday shield and the component member.
6. The substrate processing apparatus according to claim 5 , wherein the intermediate layer is a dielectric formed by spraying.
7. The substrate processing apparatus according to claim 1 or 2 , wherein the component member and the second dielectric member are made of quartz.
8. The substrate processing apparatus according to claim 1 or 2 , wherein the conductive member is formed on the component member by deposition or spraying.
9. The substrate processing apparatus according to claim 1 or 2 , wherein the conductive member is formed by bonding a metal plate on the component member.
10. An etching method of a metal film formed on a substrate by use of a substrate processing apparatus, the substrate processing apparatus comprising:
a vacuum container having a processing space in which a substrate is processed and a plasma forming space in which plasma is formed;
a component member made of a dielectric which is part of the vacuum container and configures at least part of the plasma forming space;
a conductive member fixed on the component member;
a faraday shield fixed on the plasma forming space side of the component member;
a first dielectric member coating the plasma forming space side of the faraday shield; and
a second dielectric member provided on the plasma forming space side of the first dielectric member,
wherein the conductive member is provided on the component member on a side opposite to the plasma forming space side,
wherein the faraday shield is fixed to a position opposite to the conductive member with the component member therebetween,
wherein the first dielectric member is formed to coat the faraday shield so that the faraday shield has a floating potential,
wherein the second dielectric member is provided at a position opposite to the faraday shield with the first dielectric member therebetween, and
wherein the vacuum container has a protrusion part, and the second dielectric member is exchangeably provided on the protrusion part.
11. The etching method of a metal film according to claim 10 , wherein a self-bias is generated on the surface of the second dielectrc member due to power supplied to the conductive member, and the self-bias is set at a value such that an etching rate of the metal is higher than a rate at which a metal in the metal film is deposited on the surface of the second dielectric member.
12. The etching method of a metal film according to claim 10 or 11 , wherein the etching method is an ion beam etching method for etching by use of an ion beam formed by extracting ions from the plasma.
13. The etching method of a metal film according to claim 10 or 11 wherein the etching method is a reactive ion etching method for etching by pulling in ions from the plasma by a voltage applied to the substrate.
14. A method for manufacturing a magnetoresistive effect element manufactured by use of the etching method according to claim 10 or 11 .
15. The substrate processing apparatus according to claim 1 , wherein the second dielectric member is exchangeably provided on the protrusion part with a predetermined interval between the first dielectric member and the second dielectric member.
16. The etching method of a metal film according to claim 10 , wherein the second dielectric member is exchangeably provided on the protrusion part with a predetermined interval between the first dielectric member and the second dielectric member.