Methods of manufacturing semiconductor devices

1. A method of manufacturing a semiconductor device, the method comprising:

forming a fin-type active region protruding from a substrate;

forming a gate insulating film on a top surface and both sidewalls of the fin-type active region, the gate insulating film including a high-k dielectric film;

forming a metal-containing layer on the gate insulating film;

forming a silicon capping layer including hydrogen atoms on the metal-containing layer;

removing a portion of the hydrogen atoms in the silicon capping layer from the silicon capping layer;

removing the silicon capping layer and at least a portion of the metal-containing layer; and

forming a gate electrode on the gate insulating film, the gate electrode extending on the top surface and the both sidewalls of the fin-type active region.

2. The method of claim 1 , wherein the removing the portion of the hydrogen atoms in the silicon capping layer comprises exposing the silicon capping layer to ultraviolet (UV) light.

3. The method of claim 2 , wherein the forming of the silicon capping layer and the exposing of the silicon capping layer to the UV light are performed while maintaining a vacuum atmosphere.

4. The method of claim 2 , wherein the UV light has a wavelength of about 280 nm to about 380 nm.

5. The method of claim 2 , wherein the forming of the silicon capping layer comprises forming the silicon capping layer in an amorphous phase, and

wherein the method further comprises performing a rapid thermal annealing (RTA) process to covert the silicon capping layer in the amorphous phase into the silicon capping layer in a polycrystalline phase after the forming of the silicon capping layer.

6. The method of claim 5 , wherein the RTA process is performed before or after the silicon capping layer is exposed to the UV light.

7. The method of claim 5 , wherein the exposing of the silicon capping layer to the UV light is performed in an atmosphere of a first temperature, and

wherein the performing of the RTA process comprises applying heat to the substrate at a second temperature higher than the first temperature.

8. The method of claim 7 , wherein the first temperature ranges from about 300° C. to about 600° C.

9. The method of claim 7 , wherein the second temperature ranges from about 800° C. to about 1200° C.

10. The method of claim 7 , wherein the exposing of the silicon capping layer to the UV light is performed for a first time duration, and

wherein the performing of the RTA process comprises performing a thermal treatment for a second time duration that is shorter than the first time duration.

11. The method of claim 5 , wherein the forming of the silicon capping layer, the exposing of the silicon capping layer to the UV light, and the RTA process are performed while maintaining a vacuum atmosphere.

12. The method of claim 5 , further comprising exposing the metal-containing layer to an oxygen-containing atmosphere to oxidize at least a portion of the metal-containing layer before the forming of the silicon capping layer.

13. A method of manufacturing a semiconductor device, the method comprising:

forming a gate insulating film on a substrate, the gate insulating film including a high-k dielectric film;

forming a metal layer on the gate insulating film, the metal layer including oxygen or nitrogen;

forming a capping layer on the metal layer;

performing an anneal process to diffuse a portion of the oxygen or a portion of the nitrogen in the metal layer into the high-k dielectric film; and

forming a gate electrode on the gate insulating film after performing the anneal process,

wherein forming the metal layer comprises:

forming a preliminary metal layer on the gate insulating film; and

exposing the preliminary metal layer to oxygen or nitrogen to form the metal layer including the oxygen or the nitrogen.

14. The method of claim 13 , wherein the capping layer comprises hydrogen, and

wherein the method further comprises at least partially removing the hydrogen in the capping layer before or after performing the anneal process.

15. The method of claim 14 , wherein at least partially removing the hydrogen in the capping layer comprises exposing the capping layer to UV light.

16. The method of claim 15 , wherein exposing the capping layer to the UV light is performed at a temperature that ranges from about 300° C. to about 600° C.

17. A method of manufacturing a semiconductor device, the method comprising:

forming a gate insulating film on a substrate, the gate insulating film including a high-k dielectric film;

forming a metal layer on the gate insulating film, the metal layer including oxygen or nitrogen;

forming a capping layer on the metal layer, the capping layer comprising hydrogen;

performing an anneal process to diffuse a portion of the oxygen or a portion of the nitrogen in the metal layer into the high-k dielectric film;

at least partially removing the hydrogen in the capping layer before or after performing the anneal process; and

forming a gate electrode on the gate insulating film after performing the anneal process.

18. The method of claim 17 , wherein at least partially removing the hydrogen in the capping layer comprises exposing the capping layer to UV light.

19. The method of claim 18 , wherein exposing the capping layer to the UV light is performed at a temperature that ranges from about 300° C. to about 600° C.

20. The method of claim 17 , wherein forming the metal layer comprises:

forming a preliminary metal layer on the gate insulating film; and

exposing the preliminary metal layer to oxygen or nitrogen to form the metal layer including the oxygen or the nitrogen.